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Paper | Open Access

Pulse-shaped femtosecond-laser-modified Si:S photodetector for ultrawide-spectrum focal plane arrays and weak-light detection

Jiaxin Cao1,2 Ziyang Zheng1,2Xu Zhou1,2 ( )Guanting Song1,2Qiang Wu1,2 ( )Jingjun Xu1,2
Key Laboratory of Weak-Light Nonlinear Photonics, Ministry of Education, TEDA Institute of Applied Physics and School of Physics, Nankai University, Tianjin 300457, People’s Republic of China
Shenzhen Research Institute of Nankai University, Shenzhen 518083, People’s Republic of China
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Abstract

High-performance Si photodetectors featuring an ultrawide spectral range can be realized through femtosecond (fs)-laser modification, enabling their broad application in focal plane arrays (FPAs) for artificial intelligence and complex operational scenarios. However, laser-induced surface inhomogeneity and elevated dark currents reduce the signal-to-noise ratio of FPAs in image detector arrays. To address these challenges, a pulse-shaping technique is employed here to precisely control light–matter interactions during laser modification. This approach not only improves the uniformity of surface microstructures but also significantly suppresses dark currents. The optimized device exhibits high responsivity across the visible to near-infrared spectrum, with a peak responsivity of 164.17 A·W−1 at −2.5 V. Notably, the photodetector demonstrates exceptional weak-light detection capacity at room temperature owing to its record-high specific detectivity of 1.71 × 1014 Jones, surpassing that of all previously reported Si-based photodetectors. These results highlight substantial advancements in the application of fs-laser-modified Si photodetectors, underscoring their potential in fields such as autonomous driving, weak-light detection, and medical monitoring.

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International Journal of Extreme Manufacturing

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Cite this article:
Cao J, Zheng Z, Zhou X, et al. Pulse-shaped femtosecond-laser-modified Si:S photodetector for ultrawide-spectrum focal plane arrays and weak-light detection. International Journal of Extreme Manufacturing, 2026, 8(3). https://doi.org/10.1088/2631-7990/ae3b83

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Received: 18 July 2025
Revised: 15 September 2025
Accepted: 21 January 2026
Published: 17 February 2026
© 2026 The Author(s).

Original content from this work may be used under the terms of the Creative Commons Attribution 4.0 licence. Any further distribution of this work must maintain attribution to the author(s) and the title of the work, journal citation and DOI.