Frontiers in atomic-level manufacturing: atomic-scale electrochemical deposition

Atomic-level manufacturing, as the “keystone” of future technology, marks the transformative shift from the micro/nano era based on “classical theory” to the atomic era grounded in “quantum theory”. It enables the precise control of matter arrangement and composition at the atomic scale, thereby achieving large-scale production of atomically precise and structured products. Electrochemical deposition (ECD), a typical “atom addition” fabrication method for electrochemical atomic and close-to-atomic scale manufacturing (EC-ACSM), enables precise control over material properties at the atomic scale, allowing breakthroughs in revolutionary performance of semiconductors, quantum computing, new materials, nanomedicine, etc. This review explores the fundamentals of EC-ACSM, particularly at the electrode/electrolyte interface, and investigates maskless ECD techniques, highlighting their advantages, limitations, and the role of in situ monitoring and advanced simulations in the process optimization. However, atomic electrochemical deposition faces significant challenges in precise control over atom-ion interactions, electrode-electrolyte interfacial dynamics, and surface defects. In the future, overcoming these obstacles is critical to advancing EC-ACSM and unlocking its full potential in scalability for industrial applications. EC-ACSM can drive the highly customized design of materials and offer strong technological support for the development of future science, ushering in a new atomic era of material innovation and device manufacturing.