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Paper | Open Access

Optimizing film thickness to delay strut fracture in high-entropy alloy composite microlattices

James Utama Surjadi1,3Xiaobin Feng1,3Wenzhao Zhou2,3Yang Lu1,2 ( )
Department of Mechanical Engineering, City University of Hong Kong, Kowloon, Hong Kong Special Administrative Region of China
Nano-Manufacturing Laboratory (NML), City University of Hong Kong Shenzhen Research Institute, Shenzhen 518057, People’s Republic of China

3These authors contributed equally to this work.

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Abstract

Incorporating high-entropy alloys (HEAs) in composite microlattice structures yields superior mechanical performance and desirable functional properties compared to conventional metallic lattices. However, the modulus mismatch and relatively poor adhesion between the soft polymer core and stiff metallic film coating often results in film delamination and brittle strut fracture at relatively low strain levels (typically below 10%). In this work, we demonstrate that optimizing the HEA film thickness of a CoCrNiFe-coated microlattice completely suppresses delamination, significantly delays the onset of strut fracture (~100% increase in compressive strain), and increases the specific strength by up to 50%. This work presents an efficient strategy to improve the properties of metal-composite mechanical metamaterials for structural applications.

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International Journal of Extreme Manufacturing
Pages 025101-025101

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Cite this article:
Surjadi JU, Feng X, Zhou W, et al. Optimizing film thickness to delay strut fracture in high-entropy alloy composite microlattices. International Journal of Extreme Manufacturing, 2021, 3(2): 025101. https://doi.org/10.1088/2631-7990/abd8e8

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Received: 17 June 2020
Revised: 27 October 2021
Accepted: 06 January 2021
Published: 25 January 2021
© 2021 The Author(s).

Original content from this work may be used under the terms of the Creative Commons Attribution 3.0 licence. Any further distribution of this work must maintain attribution to the author(s) and the title of the work, journal citation and DOI.