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Topical Review | Open Access

A review on microstructures and properties of high entropy alloys manufactured by selective laser melting

Chen Zhang1 Junkai Zhu1Huai Zheng2Hui Li1,2Sheng Liu1,2Gary J Cheng3
The Institute of Technological Sciences, Wuhan University, Wuhan 430072, People’s Republic of China
School of Power and Mechanical Engineering, Wuhan University, Wuhan 430072, People’s Republic of China
School of Industrial Engineering, Purdue University, West Lafayette, IN 47906, United States of America
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Abstract

High entropy alloys (HEAs) with multi-component solid solution microstructures have the potential for large-scale industrial applications due to their excellent mechanical and functional properties. However, the mechanical properties of HEAs limit the selection of processing technologies. Additive manufacturing technology possesses strong processing adaptability, making itthe best candidate method to overcome this issue. This comprehensive review examines the current state of selective laser melting (SLM) of HEAs. Introducing SLM to HEAs processing is motivated by its high quality for dimensional accuracy, geometric complexity, surface roughness, and microstructure. This review focuses on analyzing the current developments and challenges in SLM of HEAs, including defects, microstructures, and properties, as well as strengthing prediction models of fabricated HEAs. This review also offers directions for future studies to address existing challenges and promote technological advancement.

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International Journal of Extreme Manufacturing
Pages 032003-032003

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Cite this article:
Zhang C, Zhu J, Zheng H, et al. A review on microstructures and properties of high entropy alloys manufactured by selective laser melting. International Journal of Extreme Manufacturing, 2020, 2(3): 032003. https://doi.org/10.1088/2631-7990/ab9ead

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Received: 27 February 2020
Revised: 29 April 2020
Accepted: 19 June 2020
Published: 20 July 2020
© 2020 The Author(s).

Original content from this work may be used under the terms of the Creative Commons Attribution 3.0 licence. Any further distribution of this work must maintain attribution to the author(s) and the title of the work, journal citation and DOI.