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Research Article | Open Access

Enhanced thermoelectric performance of Sb-doped Mg2Si0.4Sn0.6 via doping, alloying and nanoprecipitation

Binhao Wanga, Haidong Zhaoa, Jianghua Lib( ), Bin Zhanga, Dan Wanga, Chen Chena, Aihua Songa, Wentao Hua, Dongli Yua, Bo Xua( ), Yongjun Tiana
Center for High Pressure Science, State Key Laboratory of Metastable Materials Science and Technology, Yanshan University, Qinhuangdao, Hebei, 066004, China
Shaanxi University of Technology, Hanzhong, Shaanxi, 723000, China

Peer review under responsibility of The Chinese Ceramic Society.

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Abstract

With the advantages of eco-friendliness, low cost, and low density, Mg2(Si,Sn) solid solutions are promising candidates for thermoelectric applications. In this work, Sb-doped Mg2Si0.4Sn0.6 bulks were prepared with a combined method of solid-state reaction and high pressure synthesis, followed by spark plasma sintering. Our investigations show that Sb doping optimizes the carrier concentration, while Si/Sn alloying effectively suppresses the lattice thermal conductivity and induces a convergence of the two lowest-lying conduction bands. Additionally, numerous coherent Sn-rich nanoprecipitates are formed within micron-sized grains. All these factors contribute synergistically to improving the thermoelectric properties of Mg2Si0.4Sn0.6. The optimal Mg2(Si0.4Sn0.6)0.985Sb0.015 exhibits a power factor higher than 4 000 μW·m−1·K−2 and a lattice thermal conductivity less than 0.8 W·m−1·K−1 at temperatures higher than 600 K, leading to the highest ZT of 1.61 at 823 K. Current work demonstrates an effective approach to enhancing the thermoelectric performance of n-type Mg2X solid solutions through doping, alloying, and microstructure modification.

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Journal of Materiomics
Pages 285-292

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Cite this article:
Wang B, Zhao H, Li J, et al. Enhanced thermoelectric performance of Sb-doped Mg2Si0.4Sn0.6 via doping, alloying and nanoprecipitation. Journal of Materiomics, 2024, 10(2): 285-292. https://doi.org/10.1016/j.jmat.2023.06.001

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Received: 13 April 2023
Revised: 25 May 2023
Accepted: 05 June 2023
Published: 24 June 2023
© 2023 The Authors.

This is an open access article under the CC BY-NC-ND license (http://creativecommons.org/licenses/by-nc-nd/4.0/).