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Growth of Ge Layer on Relaxed Ge-Rich SiGe by Ultrahigh Vacuum Chemical Vapor Deposition

Jialei LIURenrong LIANGJing WANG( )Yang XUJun XUZhihong LIU
Institute of Microelectronics, Tsinghua University, Beijing 100084, China
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Abstract

The paper describes the growth of a germanium (Ge) film on a thin relaxed Ge-rich SiGe buffer. The thin Ge-rich SiGe buffer layer was achieved through a combination of ultrahigh vacuum chemical vapor deposition (UHVCVD) SiGe epitaxial growth and SiGe oxidation. A lower Ge content strained SiGe layer was first grown on the Si (001) substrate and then the Ge mole fraction was increased by oxidation. After removal of the surface oxide, a higher Ge content SiGe layer was grown and oxidized again. The Ge mole fraction was increased to 0.8 in the 50 nm thick SiGe layer. Finally a 150 nm thick pure Ge film was grown on the SiGe buffer layer using the UHVCVD system. This technique produces a much thinner buffer than the conventional compositionally graded relaxed SiGe method with the same order of magnitude threading dislocation density.

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Tsinghua Science and Technology
Pages 747-751

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Cite this article:
LIU J, LIANG R, WANG J, et al. Growth of Ge Layer on Relaxed Ge-Rich SiGe by Ultrahigh Vacuum Chemical Vapor Deposition. Tsinghua Science and Technology, 2007, 12(6): 747-751. https://doi.org/10.1016/S1007-0214(07)70184-0

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Received: 12 January 2007
Revised: 08 June 2007
Published: 01 December 2007
© Tsinghua University Press 2007