AI Chat Paper
Note: Please note that the following content is generated by AMiner AI. SciOpen does not take any responsibility related to this content.
{{lang === 'zh_CN' ? '文章概述' : 'Summary'}}
{{lang === 'en_US' ? '中' : 'Eng'}}
Chat more with AI
Powered by AMiner. Clicking this button will take you away from SciOpen.
Home Tsinghua Science and Technology Article
PDF (698.9 KB)
Cite
EndNote(RIS) BibTeX
Collect
Submit Manuscript AI Chat Paper
Show Outline
Outline
Show full outline
Hide outline
Outline
Show full outline
Hide outline

Influence of Temperature on Creep Behavior of Ag Particle Enhancement SnCu Based Composite Solder

Yanfu YAN( ), Lifang FENG, Keke ZHANG, Jiuba WEN
School of Materials Science and Engineering, Henan University of Science and Technology, Luoyang 471003, China
Show Author Information

Abstract

The creep properties of solder alloys are an important factor affecting the reliability of soldered joints in surface mount technologies. Particle-enhancement is one way to improve the properties of solder alloys. The temperature of the solder joint is one of the primary factors affecting the solder joint creep properties. Single shear lap creep specimens with a 1 mm2 cross-sectional area were fabricated using Ag particle enhancement 99.3Sn0.7Cu based composite solder and 99.3Sn0.7Cu eutectic solder to examine the influence of temperature on the creep behavior of solder joints. The results show that the solder joint creep resistance of the composite solder joint was generally superior to that of the 99.3Sn0.7Cu solder joint. The creep rupture life of the composite solder joint was reduced by increasing temperatures at a faster rate than that of the 99.3Sn0.7Cu eutectic solder joint.

Keywords

creep rupture lifecomposite solderparticle-enhancement99.3Sn0.7Cu

References

【1】
【1】
 
 
Crossref Google Scholar
Tsinghua Science and Technology
Volume 12 Issue 3,
June 2007
Pages 296-301
DOI: 10.1016/S1007-0214(07)70044-5

{{item.num}}

Comments on this article

Go to comment

< Back to all reports

Review Status: {{reviewData.commendedNum}} Commended , {{reviewData.revisionRequiredNum}} Revision Required , {{reviewData.notCommendedNum}} Not Commended Under Peer Review

Review Comment

Cite this Report
Close
Close
Cite this article:
YAN Y, FENG L, ZHANG K, et al. Influence of Temperature on Creep Behavior of Ag Particle Enhancement SnCu Based Composite Solder. Tsinghua Science and Technology, 2007, 12(3): 296-301. https://doi.org/10.1016/S1007-0214(07)70044-5

3

Views

0

Downloads

0

Crossref

N/A

Web of Science

0

Scopus

0

CSCD
Received: 13 January 2006
Revised: 20 November 2006
Published: 01 June 2007
© Tsinghua University Press 2007