Atomistic understanding of rough surface on the interfacial friction behavior during the chemical mechanical polishing process of diamond

Song YUAN; Xiaoguang GUO; Hao WANG; Renke KANG; Shang GAO

doi:10.1007/s40544-023-0760-8

Friction 2024, 12(6): 1119-1132 https://doi.org/10.1007/s40544-023-0760-8

Research Article |

Open Access | Issue | Published: 04 July 2023

Atomistic understanding of rough surface on the interfacial friction behavior during the chemical mechanical polishing process of diamond

Show Author's Information Hide Author's Information Song YUAN, Xiaoguang GUO, Hao WANG, Renke KANG, Shang GAO(

)

State Key Laboratory of High-performance Precision Manufacturing, Dalian University of Technology, Dalian 116024, China

Keywords:

friction, chemical mechanical polishing (CMP), diamond, random roughness, reactive force field molecular dynamics (ReaxFF MD), Weierstrass–Mandelbrot (W–M) function

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YUAN S, GUO X, WANG H, et al. Atomistic understanding of rough surface on the interfacial friction behavior during the chemical mechanical polishing process of diamond. Friction, 2024, 12(6): 1119-1132. https://doi.org/10.1007/s40544-023-0760-8

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Abstract

The roughness of the contact surface exerts a vital role in rubbing. It is still a significant challenge to understand the microscopic contact of the rough surface at the atomic level. Herein, the rough surface with a special root mean square (RMS) value is constructed by multivariate Weierstrass–Mandelbrot (W–M) function and the rubbing process during that the chemical mechanical polishing (CMP) process of diamond is mimicked utilizing the reactive force field molecular dynamics (ReaxFF MD) simulation. It is found that the contact area A/A₀ is positively related with the load, and the friction force F depends on the number of interfacial bridge bonds. Increasing the surface roughness will increase the friction force and friction coefficient. The model with low roughness and high lubrication has less friction force, and the presence of polishing liquid molecules can decrease the friction force and friction coefficient. The RMS value and the degree of damage show a functional relationship with the applied load and lubrication, i.e., the RMS value decreases more under larger load and higher lubrication, and the diamond substrate occurs severer damage under larger load and lower lubrication. This work will generate fresh insight into the understanding of the microscopic contact of the rough surface at the atomic level.

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Atomistic understanding of rough surface on the interfacial friction behavior during the chemical mechanical polishing process of diamond

Show Author's information Hide Author's Information Song YUAN, Xiaoguang GUO, Hao WANG, Renke KANG, Shang GAO(

)

State Key Laboratory of High-performance Precision Manufacturing, Dalian University of Technology, Dalian 116024, China

Abstract

Keywords: friction, chemical mechanical polishing (CMP), diamond, random roughness, reactive force field molecular dynamics (ReaxFF MD), Weierstrass–Mandelbrot (W–M) function

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Acknowledgements

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Publication history

Received: 01 January 2023

Revised: 11 February 2023

Accepted: 15 March 2023

Published: 04 July 2023

Issue date: June 2024

Copyright

Acknowledgements

The authors greatly appreciate the financial support of the National Key R&D Program of China (2022YFB3404304) and the National Natural Science Foundation of China (No. 5217052183). The authors acknowledge Beijng PARATERA Tech Corp., Ltd., China, for providing high-performance computing (HPC) resources that have contributed to the research results reported within this paper.

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