Chemically-induced active micro-nano bubbles assisting chemical mechanical polishing: Modeling and experiments

Lei XU; Kihong PARK; Hong LEI; Pengzhan LIU; Eungchul KIM; Yeongkwang CHO; Taesung KIM; Chuandong CHEN

doi:10.1007/s40544-022-0668-8

Friction 2023, 11(9): 1624-1640 https://doi.org/10.1007/s40544-022-0668-8

Research Article |

Open Access | Issue | Published: 25 March 2023

Chemically-induced active micro-nano bubbles assisting chemical mechanical polishing: Modeling and experiments

Show Author's Information Hide Author's Information Lei XU^{¹^,²^,³}, Kihong PARK^², Hong LEI^{¹^,³}(

), Pengzhan LIU^², Eungchul KIM^², Yeongkwang CHO^², Taesung KIM^{²^,⁴}(

), Chuandong CHEN^⁵

1 School of Materials Science and Engineering, Shanghai University, Shanghai 200444, China

2 School of Mechanical Engineering, Sungkyunkwan University, Gyeonggi-do 16419, Republic of Korea

3 Research Center of Nano Science and Technology, Shanghai University, Shanghai 200444, China

4 SKKU Advanced Institute of Nanotechnology, Sungkyunkwan University, Gyeonggi-do 16419, Republic of Korea

5 Baotou Research Institute of Rare Earths, Baotou 014030, China

Keywords:

modeling, mixed lubrication, material removal mechanism, chemical mechanical polishing (CMP), micro-nano bubbles

Cite this article:

XU L, PARK K, LEI H, et al. Chemically-induced active micro-nano bubbles assisting chemical mechanical polishing: Modeling and experiments. Friction, 2023, 11(9): 1624-1640. https://doi.org/10.1007/s40544-022-0668-8

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Abstract

The material loss caused by bubble collapse during the micro-nano bubbles auxiliary chemical mechanical polishing (CMP) process cannot be ignored. In this study, the material removal mechanism of cavitation in the polishing process was investigated in detail. Based on the mixed lubrication or thin film lubrication, bubble–wafer plastic deformation, spherical indentation theory, Johnson–Cook (J–C) constitutive model, and the assumption of periodic distribution of pad asperities, a new model suitable for micro-nano bubble auxiliary material removal in CMP was developed. The model integrates many parameters, including the reactant concentration, wafer hardness, polishing pad roughness, strain hardening, strain rate, micro-jet radius, and bubble radius. The model reflects the influence of active bubbles on material removal. A new and simple chemical reaction method was used to form a controllable number of micro-nano bubbles during the polishing process to assist in polishing silicon oxide wafers. The experimental results show that micro-nano bubbles can greatly increase the material removal rate (MRR) by about 400% and result in a lower surface roughness of 0.17 nm. The experimental results are consistent with the established model. In the process of verifying the model, a better understanding of the material removal mechanism involved in micro-nano bubbles in CMP was obtained.

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About this article

Chemically-induced active micro-nano bubbles assisting chemical mechanical polishing: Modeling and experiments

Show Author's information Hide Author's Information Lei XU^{¹^,²^,³}, Kihong PARK^², Hong LEI^{¹^,³}(

), Pengzhan LIU^², Eungchul KIM^², Yeongkwang CHO^², Taesung KIM^{²^,⁴}(

), Chuandong CHEN^⁵

1 School of Materials Science and Engineering, Shanghai University, Shanghai 200444, China

2 School of Mechanical Engineering, Sungkyunkwan University, Gyeonggi-do 16419, Republic of Korea

3 Research Center of Nano Science and Technology, Shanghai University, Shanghai 200444, China

4 SKKU Advanced Institute of Nanotechnology, Sungkyunkwan University, Gyeonggi-do 16419, Republic of Korea

5 Baotou Research Institute of Rare Earths, Baotou 014030, China

Abstract

Keywords: modeling, mixed lubrication, material removal mechanism, chemical mechanical polishing (CMP), micro-nano bubbles

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Publication history

Received: 21 May 2021

Revised: 13 December 2021

Accepted: 16 June 2022

Published: 25 March 2023

Issue date: September 2023

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Acknowledgements

This work was supported by the National Natural Science Foundation of China (No. 51975343), Science and Technology Major Project of Inner Mongolia Autonomous Region in China (No. 2021ZD0028), Shanghai Technical Service Center for Advanced Ceramics Structure Design and Precision Manufacturing (No. 20DZ2294000), and the China Scholarship Council.

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