Novel three-body nano-abrasive wear mechanism

Ruling CHEN; Shaoxian LI

doi:10.1007/s40544-020-0481-1

Friction 2022, 10(5): 677-687 https://doi.org/10.1007/s40544-020-0481-1

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Open Access | Issue | Published: 27 February 2021

Novel three-body nano-abrasive wear mechanism

Show Author's Information Hide Author's Information Ruling CHEN(

), Shaoxian LI

College of Mechanical Engineering, Donghua University, Shanghai 201620, China

Keywords:

molecular dynamics simulation, material removal mechanism, chemical mechanical polishing (CMP), wear mechanism, three-body abrasive wear

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CHEN R, LI S. Novel three-body nano-abrasive wear mechanism. Friction, 2022, 10(5): 677-687. https://doi.org/10.1007/s40544-020-0481-1

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Abstract

Current three-body abrasive wear theories are based on a macroscale abrasive indentation process, and these theories claim that material wear cannot be achieved without damaging the hard mating surface. In this study, the process of three-body nano-abrasive wear of a system including a single crystalline silicon substrate, an amorphous silica cluster, and a polyurethane pad, based on a chemical mechanical polishing (CMP) process, is investigated via molecular dynamics simulations. The cluster slid in a suspended state in smooth regions and underwent rolling impact in the asperity regions of the silicon surface, realizing non-damaging monoatomic material removal. This proves that indentation-plowing is not necessary when performing CMP material removal. Therefore, a non-indentation rolling-sliding adhesion theory for three-body nano-abrasive wear between ultrasoft/hard mating surfaces is proposed. This wear theory not only unifies current mainstream CMP material removal theories, but also clarifies that monoatomic material wear without damage can be realized when the indentation depth is less than zero, thereby perfecting the relationship between material wear and surface damage. These results provide new understanding regarding the CMP microscopic material removal mechanism as well as new research avenues for three-body abrasive wear theory at the monoatomic scale.

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About this article

Novel three-body nano-abrasive wear mechanism

Show Author's information Hide Author's Information Ruling CHEN(

), Shaoxian LI

College of Mechanical Engineering, Donghua University, Shanghai 201620, China

Abstract

Keywords: molecular dynamics simulation, material removal mechanism, chemical mechanical polishing (CMP), wear mechanism, three-body abrasive wear

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Publication history

Received: 01 July 2020

Revised: 07 October 2020

Accepted: 07 December 2020

Published: 27 February 2021

Issue date: May 2022

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Acknowledgements

We acknowledge Dr. Ji’nan DENG in Chongqing University for her help in the process of writing this manuscript. This work was supported by the National Natural Science Foundation of China (Nos. 51375291 and 91323302) and the Natural Science Foundation of Shanghai (No. 19ZR1401500).

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