Journal Home > Volume 9 , Issue 6

Ethylenediamine with two -NH2 functional groups was used as a critical complexing agent in chemical mechanical polishing (CMP) slurries for a high carbon chromium GCr15 bearing steel (equivalent to AISI 52100). The polishing performance and corresponding mechanism of -NH2 functional groups were thoroughly investigated as a function of pH. It is revealed that, when polished with ethylenediamine and H2O2-based slurries, the material removal rate (MRR) and surface roughness Ra of GCr15 steel gradually decrease as pH increases. Compared with acidic pH of 4.0, at alkaline pH of 10.0, the surface film of GCr15 steel has much higher corrosion resistance and wear resistance, and thus the material removal caused by the pure corrosion and corrosion-enhanced wear are greatly inhibited, resulting in much lower MRR and Ra. Moreover, it is confirmed that a more protective composite film, consisting of more Fe3+ hydroxides/oxyhydroxides and complex compounds with -NH2 functional groups of ethylenediamine, can be formed at pH of 10.0. Additionally, the polishing performance of pure iron and a medium carbon 45 steel exhibits a similar trend as GCr15 steel. The findings suggest that acidic pH could be feasible for amine groups-based complexing agents to achieve efficient CMP of iron-based metals.


menu
Abstract
Full text
Outline
About this article

Exploring the role of --NH2 functional groups of ethylenediamine in chemical mechanical polishing of GCr15 bearing steel

Show Author's information Hanqiang WU1Liang JIANG1( )Xia ZHONG1Jinwei LIU1Na QIN2Linmao QIAN1
Tribology Research Institute, State Key Laboratory of Traction Power, Southwest Jiaotong University, Chengdu 610031, China
School of Mechanical Engineering, Southwest Jiaotong University, Chengdu 610031, China

Abstract

Ethylenediamine with two -NH2 functional groups was used as a critical complexing agent in chemical mechanical polishing (CMP) slurries for a high carbon chromium GCr15 bearing steel (equivalent to AISI 52100). The polishing performance and corresponding mechanism of -NH2 functional groups were thoroughly investigated as a function of pH. It is revealed that, when polished with ethylenediamine and H2O2-based slurries, the material removal rate (MRR) and surface roughness Ra of GCr15 steel gradually decrease as pH increases. Compared with acidic pH of 4.0, at alkaline pH of 10.0, the surface film of GCr15 steel has much higher corrosion resistance and wear resistance, and thus the material removal caused by the pure corrosion and corrosion-enhanced wear are greatly inhibited, resulting in much lower MRR and Ra. Moreover, it is confirmed that a more protective composite film, consisting of more Fe3+ hydroxides/oxyhydroxides and complex compounds with -NH2 functional groups of ethylenediamine, can be formed at pH of 10.0. Additionally, the polishing performance of pure iron and a medium carbon 45 steel exhibits a similar trend as GCr15 steel. The findings suggest that acidic pH could be feasible for amine groups-based complexing agents to achieve efficient CMP of iron-based metals.

Keywords: chemical mechanical polishing (CMP), complexing agent, bearing steel

References(54)

[1]
Yin F, Hua L, Mao H, Han X. Constitutive modeling for flow behavior of GCr15 steel under hot compression experiments. Mater Design 43: 393–401(2013)
[2]
Bhadeshia H K D H. Steels for bearings. Prog Mater Sci 57(2): 268–435(2012)
[3]
Mohd Yusof N F, Ripin Z M. Analysis of surface parameters and vibration of roller bearing. Tribol T 57(4): 715–729(2014)
[4]
Takabi J, Khonsari M M. On the dynamic performance of roller bearings operating under low rotational speeds with consideration of surface roughness. Tribol Int 86: 62–71(2015)
[5]
Komata H, Iwanaga Y, Ueda T, Ueda K, Mitamura N. Enhanced performance of rolling bearings by improving the resistance of rolling elements to surface degradation. In Bearing Steel Technologies: 10th Volume, Advances in Steel Technologies for Rolling Bearings. Beswick J M, Edn. West Conshohocken, PA: ASTM International, 2015: 272-290.
[6]
Chi X, Suo X H. Study on float polishing of metal nanometer surface. Advanced Materials Research 154-155: 1757–1760(2011)
[7]
Li Y. Microelectronic Applications of Chemical Mechanical Planarization. Hoboken, New Jersey (USA): John Wiley & Sons, Inc., 2007.
DOI
[8]
Zhao D, Lu X. Chemical mechanical polishing: Theory and experiment. Friction 1(4): 306–326(2013)
[9]
Manabu T. The way to zeros: The future of semiconductor device and chemical mechanical polishing technologies. Jpn J Appl Phys 55(6S3): 06JA01 (2016)
[10]
Kao M J, Hsu F C, Peng D X. Synthesis and characterization of SiO2 nanoparticles and their efficacy in chemical mechanical polishing steel substrate. Adv Mater Sci Eng 2014: 1–8(2014)
[11]
Peng D-X. Chemical mechanical polishing of steel substrate using aluminum nanoparticles abrasive slurry. Ind Lubr Tribol 66(1): 124-130(2014)
[12]
Peng D-X. Optimization of chemical mechanical polishing parameters on surface roughness of steel substrate with aluminum nanoparticles via Taguchi approach. Ind Lubr Tribol 66(6): 685–690(2014)
[13]
Jiang L, He Y, Luo J. Chemical mechanical polishing of steel substrate using colloidal silica-based slurries. Appl Surf Sci 330: 487–495(2015)
[14]
Koroleva L F. Abrasive properties of modified oxides for finish polishing of steel. AIP Conf Proc 1915(1): 040027 (2017)
[15]
Liu P, Lu X, Liu Y, Luo J, Pan G. Chemical mechanical planarization of copper using ethylenediamine and hydrogen peroxide based slurry. In Advanced Tribology. Luo J, Meng Y, Shao T, Zhao Q, Edns. Springer, Berlin, Heidelberg, 2009: 908-911.
DOI
[16]
Gorantla V R K, Goia D, Matijević E, Babu S V. Role of amine and carboxyl functional groups of complexing agents in slurries for chemical mechanical polishing of copper. J Electrochem Soc   152(12): G912G916(2005)10.1149/1.2083287
[17]
Patri U B, Aksu S, Babu S V. Role of the functional groups of complexing agents in copper slurries. J Electrochem Soc 153(7): G650–G659(2006)
[18]
Wu H, Jiang L, Liu J, Deng C, Huang H, Qian L. Efficient chemical mechanical polishing of AISI 52100 bearing steel with TiSol-NH4 dispersion-based slurries. Tribol Lett 68(1): 34 (2020)
[19]
Hariharaputhiran M, Zhang J, Ramarajan S, Keleher J, Li Y, Babu S. Hydroxyl radical formation in H2O2-amino acid mixtures and chemical mechanical polishing of copper. J Electrochem Soc 147(10): 3820–3826(2000)
[20]
Kobayashi M, Juillerat F, Galletto P, Bowen P, Borkovec M. Aggregation and charging of colloidal silica particles:  Effect of particle size. Langmuir 21(13): 5761–5769(2005)
[21]
Jiang L, He Y, Yang Y, Luo J. Chemical mechanical polishing of stainless steel as solar cell substrate. ECS J Solid State Sc 4(5): P162–P170(2015)
[22]
Kim Y J, Kwon O J, Kang M C, Kim J J. Effects of the functional groups of complexing agents and Cu oxide formation on Cu dissolution behaviors in Cu CMP process. J Electrochem Soc 158(2): H190–H196(2011)
[23]
Yang C, Zhang H, Guo W, Fu Y. Effects of H2O2 addition on corrosion behavior of high-strength low-alloy steel in seawater. J Chin Soc Corros Prot 33(03): 205–210(2013)
[24]
Wu W, Hao W K, Liu Z Y, Li X G, Du C W, Liao W J. Corrosion behavior of E690 high-strength steel in alternating wet-dry marine environment with different pH values. J Mater Eng Perform 24(12): 4636–4646(2015)
[25]
Wang Z, Liu J, Wu L, Han R, Sun Y. Study of the corrosion behavior of weathering steels in atmospheric environments. Corros Sci 67: 1–10(2013)
[26]
Li J, Liu Y, Lu X, Luo J, Dai Y. Material removal mechanism of copper CMP from a chemical-mechanical synergy perspective. Tribol Lett 49(1): 11–19(2013)
[27]
Li J, Liu Y, Wang T, Lu X, Luo J. Electrochemical investigation of copper passivation kinetics and its application to low-pressure CMP modeling. Appl Surf Sci 265(0): 764–770(2013)
[28]
Tripathi S, Doyle F, Dornfeld D. Tribo-chemical modeling of copper CMP. In Proceedings of VLSI Multilevel Interconnection Conference (VMIC), Fremont CA, 2006: 432-437.
[29]
Jiang L, He Y, Li J, Luo J. Passivation kinetics of 1,2,4-Triazole in copper chemical mechanical polishing. ECS J Solid State Sc 5(5): P272–P279(2016)
[30]
Xu G, Liang H, Zhao J, Li Y. Investigation of copper removal mechanisms during CMP. J Electrochem Soc 151(10): G688 (2004)
[31]
Ihnfeldt R, Talbot J B. Effect of CMP slurry chemistry on copper nanohardness. J Electrochem Soc 155(6): H412–H420(2008)
[32]
Hiromoto S. 4-corrosion of metallic biomaterials. In Metals for Biomedical Devices. Niinomi M, Edn. Woodhead Publishing, 2010: 99-121.
DOI
[33]
Du C W, Li X G, Liang P, Liu Z Y, Jia G F, Cheng Y F. Effects of microstructure on corrosion of X70 pipe steel in an alkaline soil. J Mater Eng Perform 18(2): 216–220(2009)
[34]
Selwyn L S, Argyropoulos V. Removal of chloride and iron ions from archaeological wrought iron with sodium hydroxide and ethylenediamine solutions. Stud Conserv 50(2): 81–100(2005)
[35]
Wuhan University. Analytical Chemistry. Beijing: Higher Education Press, 2016.
[36]
Incorvio M J, Contarini S. X. Ray photoelectron spectroscopic studies of metal/inhibitor systems: Structure and bonding at the iron/amine interface. J Electrochem Soc 136(9): 2493–2498(1989)
[37]
Nicholls D. The chemistry of iron, cobalt and nickel. In Comprehensive Inorganic Chemistry. JR J C B, Emeléus F R S H J, Sir Ronald Nyholm F R S, Trotman-Dickenson A F, Edns. Oxford: Pergamon Press, 1973.
[38]
Sakakibara M, Nishihara H, Aramaki K. The effects of complexing agents on the corrosion of iron in an anhydrous methanol solution. Corros Sci 34(12): 1937–1946(1993)
[39]
Jiang L, He Y, Liang H, Li Y, Luo J. Effect of potassium ions on tantalum chemical mechanical polishing in H2O2-based alkaline slurries. ECS J Solid State Sc 5(2): P100-P111(2016)
[40]
Kuiry S C, Seal S, Fei W, Ramsdell J, Desai V H, Li Y, Babu S V, Wood B. Effect of pH and H2O2 on Ta Chemical mechanical planarization: Electrochemistry and X-ray photoelectron spectroscopy studies. J Electrochem Soc 150(1): C36–C43(2003)
[41]
Zhang M, Chen K, Chen X, Peng X, Sun X, Xue D. Ethylenediamine-assisted crystallization of Fe2O3 microspindles with controllable size and their pseudocapacitance performance. Cryst Eng Comm 17(7): 1521–1525(2015)
[42]
López D A, Simison S N, de Sánchez S R. Inhibitors performance in CO2 corrosion: EIS studies on the interaction between their molecular structure and steel microstructure. Corros Sci 47(3): 735–755(2005)
[43]
Ashassi-Sorkhabi H, Seifzadeh D, Hosseini M G. EN, EIS and polarization studies to evaluate the inhibition effect of 3H-phenothiazin-3-one, 7-dimethylamin on mild steel corrosion in 1M HCl solution. Corros Sci 50(12): 3363–3370(2008)
[44]
Ashassi-Sorkhabi H, Shaabani B, Seifzadeh D. Effect of some pyrimidinic Shciff bases on the corrosion of mild steel in hydrochloric acid solution. Electrochim Acta 50(16): 3446–3452(2005)
[45]
Qiao G, Ou J. Corrosion monitoring of reinforcing steel in cement mortar by EIS and ENA. Electrochim Acta 52(28): 8008–8019(2007)
[46]
Bai M, Kato K, Umehara N, Miyake Y, Xu J, Tokisue H. Scratch–wear resistance of nanoscale super thin carbon nitride overcoat evaluated by AFM with a diamond tip. Surf Coat Tech 126(2): 181–194(2000)
[47]
Archard J F. Contact and rubbing of flat surfaces. J Appl Phys 24(8): 981–988(1953)
[48]
Mills P, Sullivan J L. A study of the core level electrons in iron and its three oxides by means of X-ray photoelectron spectroscopy. J Phys D: Appl Phys 16(5): 723–732(1983)
[49]
Wu H, Huang F, Lu X, Xu T, Lu X, Ti R, Jin Y, Zhu J. Grain size and Fe2+ concentration-dependent magnetic, dielectric, and magnetodielectric properties of Y3Fe5O12 ceramics. Phys Status Solidi A 213(1): 146–153(2016)
[50]
Brienne S H R, Zhang Q, Butler I S, Xu Z, Finch J A.X-ray photoelectron and infrared spectroscopic investigation of sphalerite activation with iron. Langmuir 10(10): 3582–3586(1994)
[51]
Allen G C, Curtis M T, Hooper A J, Tucker P M. X-Ray photoelectron spectroscopy of iron–oxygen systems. J Chem Soc, Dalton Trans (14): 1525–1530(1974)
[52]
Stoch J, Gablankowska-Kukucz J. The effect of carbonate contaminations on the XPS O 1s band structure in metal oxides. Surf Interface Anal 17(3): 165–167(1991)
[53]
Horváth D, Toth L, Guczi L. Gold nanoparticles: Effect of treatment on structure and catalytic activity of Au/Fe2O3 catalyst prepared by co-precipitation. Catal Lett 67(2): 117–128(2000)
[54]
Jiang L, Lan Y, He Y, Li Y, Luo J. Functions of Trilon® P as a polyamine in copper chemical mechanical polishing. Appl Surf Sci 288: 265–274(2014)
Publication history
Copyright
Acknowledgements
Rights and permissions

Publication history

Received: 25 May 2020
Revised: 06 August 2020
Accepted: 01 October 2020
Published: 23 November 2020
Issue date: December 2021

Copyright

© The author(s) 2020

Acknowledgements

The authors are grateful for the financial supports by National Natural Science Foundation of China (51975488, 51991373, and 51605396), National Key R&D Program of China (2018YFB2000400), Science Challenge Project (TZ2018006), Tribology Science Fund of State Key Laboratory of Tribology (SKLTKF16A02), and Laboratory of Precision Manufacturing Technology CAEP (ZD17005).

Rights and permissions

The articles published in this journal are distributed under the terms of the Creative Commons Attribution 4.0 International License (http://creativecommons.org/licenses/by/4.0/), which permits unrestricted use, distribution, and reproduction in any medium, provided you give appropriate credit to the original author(s) and the source, provide a link to the Creative Commons license, and indicate if changes were made.

The images or other third party material in this article are included in the article’s Creative Commons licence, unless indicated otherwise in a credit line to the material. If material is not included in the article’s Creative Commons licence and your intended use is not permitted by statutory regulation or exceeds the permitted use, you will need to obtain permission directly from the copyright holder.

To view a copy of this licence, visit http://creativecommons.org/licenses/by/4.0/.

Return