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Research Article | Open Access

A low-to-high friction transition in gradient nano-grained Cu and Cu-Ag alloys

Xiang CHEN1,2, Zhong HAN1( )
Shenyang National Laboratory for Materials Science, Institute of Metal Research, Chinese Academy of Sciences, Shenyang 110016, China
Nano and Heterogeneous Materials Center, School of Materials Science and Engineering, Nanjing University of Science and Technology, Nanjing 210094, China
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Abstract

A unique low-to-high friction transition is observed during unlubricated sliding in metals with a gradient nano-grained (GNG) surface layer. After persisting in the low-friction state (0.2-0.4) for tens of thousands of cycles, the coefficients of friction in the GNG copper (Cu) and copper-silver (Cu-5Ag) alloy start to increase, eventually reaching a high level (0.6-0.8). By monitoring the worn surface morphology evolution, wear-induced damage accumulation, and worn subsurface structure evolution during sliding, we found that the low-to-high friction transition is strongly correlated with distinct microstructural instabilities induced by vertical plastic deformation and wear-off of the stable nanograins in the subsurface layer. A very low wear loss of the GNG samples was achieved compared with the coarse-grained sample, especially during the low friction stage. Our results suggest that it is possible to postpone the initiation of low-to-high friction transitions and enhance the wear resistance in GNG metals by increasing the GNG structural stability against grain coarsening under high loading.

Keywords

weargradient nano-grained metalsCu and Cu-Ag alloylow-to-high friction transitionsubsurface plastic deformation

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Friction
Volume 9 Issue 6,
December 2021
Pages 1558-1567
DOI: 10.1007/s40544-020-0440-x
Cite this article:
CHEN X, HAN Z. A low-to-high friction transition in gradient nano-grained Cu and Cu-Ag alloys. Friction, 2021, 9(6): 1558-1567. https://doi.org/10.1007/s40544-020-0440-x

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Received: 09 October 2019
Revised: 04 March 2020
Accepted: 03 August 2020
Published: 25 November 2020
© The author(s) 2020

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