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The process of a cluster-containing water jet impinging on a monocrystalline silicon substrate was studied by molecular dynamics simulation. The results show that as the standoff distance increases, the jet will gradually diverge. As a result, the solidified water film between the cluster and the substrate becomes “thicker” and “looser”. The “thicker” and “looser” water film will then consume more input energy to achieve complete solidification, resulting in the stress region and the high-pressure region of the silicon substrate under small standoff distances to be significantly larger than those under large standoff distances. Therefore, the degree of damage sustained by the substrate will first experience a small change and then decrease quickly as the standoff distance increases. In summary, the occurrence and maintenance of complete solidification of the confined water film between the cluster and the substrate plays a decisive role in the level of damage formation on the silicon substrate. These findings are helpful for exploring the mechanism of an abrasive water jet.


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Study on the influence of standoff distance on substrate damage under an abrasive water jet process by molecular dynamics simulation

Show Author's information Ruling CHEN1,§( )Di ZHANG1,2,§Yihua WU2
 College of Mechanical Engineering, Donghua University, Shanghai 201620, China
 Nano-Science and Technology Research Center, Shanghai University, Shanghai 200444, China

§ These authors contributed equally to this paper

Abstract

The process of a cluster-containing water jet impinging on a monocrystalline silicon substrate was studied by molecular dynamics simulation. The results show that as the standoff distance increases, the jet will gradually diverge. As a result, the solidified water film between the cluster and the substrate becomes “thicker” and “looser”. The “thicker” and “looser” water film will then consume more input energy to achieve complete solidification, resulting in the stress region and the high-pressure region of the silicon substrate under small standoff distances to be significantly larger than those under large standoff distances. Therefore, the degree of damage sustained by the substrate will first experience a small change and then decrease quickly as the standoff distance increases. In summary, the occurrence and maintenance of complete solidification of the confined water film between the cluster and the substrate plays a decisive role in the level of damage formation on the silicon substrate. These findings are helpful for exploring the mechanism of an abrasive water jet.

Keywords: molecular dynamics simulation, standoff distance, crystalline silicon substrate, abrasive water jet

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Publication history
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Publication history

Received: 09 February 2017
Revised: 09 May 2017
Accepted: 22 May 2017
Published: 02 October 2017
Issue date: June 2018

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© The author(s) 2017

Acknowledgements

The work was financially supported by the National Natural Science Foundation of China (Nos. 51375291 and 91323302); Initial Research Funds for Young Teachers of Donghua University (No. 103-07-0053016); Innovation Program of Shanghai Municipal Education Commission (No. 13YZ004). The authors would also like to thank Prof. Hong Lei at Shanghai University and Prof. Xinchun Lu at Tsinghua University for their generous supports.

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