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Research Article | Open Access

Spatial evolution of friction of a textured wafer surface

Huaping XIAO1,a, Ke WANG2,a, Grant FOX1,a, Michel BELIN3, Julien FONTAINE3, Hong LIANG1,2,*( )
Mechanical Engineering, Texas A&M University, College Station, Texas 77843, USA
Materials Science and Engineering, Texas A&M University, College Station, Texas 77843, USA
Ecole Centrale de Lyon/CNRS-UMR 5513, France

a Xiao, Wang, and Fox contributed equally to this work.

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Abstract

Mechanical failure of integrated circuits and micro-electro-mechanical systems (MEMS) demands new understanding of friction in small devices. In present research, we demonstrated an in situ approach to measure sliding friction of a patterned surface composing multi-materials and structures. The effects of materials and surface morphology on friction and electrical contact resistance were investigated. The material transfer at the interface of dissimilar materials was found to play dominating roles in friction. The current work provides important insights from the fundamentals of friction that benefit the design of new micro-devices.

Keywords

micro-electro-mechanical systems (MEMS)patterned wafersfrictiontransfer wearelectrical contact resistance

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Friction
Volume 1 Issue 1,
March 2013
Pages 92-97
DOI: 10.1007/s40544-013-0008-0

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Cite this article:
XIAO H, WANG K, FOX G, et al. Spatial evolution of friction of a textured wafer surface. Friction, 2013, 1(1): 92-97. https://doi.org/10.1007/s40544-013-0008-0

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Received: 03 January 2013
Revised: 23 February 2013
Accepted: 27 February 2013
Published: 26 March 2013
© The author(s) 2013

This article is published with open access at Springerlink.com

Open Access: This article is distributed under the terms of the Creative Commons Attribution Noncommercial License which permits any noncommercial use, distri- bution, and reproduction in any medium, provided the original author(s) and source are credited.