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Rapid Communication | Open Access

Freeze-drying and hot-pressing strategy to embed two-dimensional Ti0.87O2 monolayers in commercial polypropylene films with enhanced dielectric properties

Wenchao TIANaFei YANcCailing CAIaZeyi WUaChenchen ZHANGbTing YINcSijia LAOcLinfeng HUa( )
Department of Materials Science, Fudan University, Shanghai 200433, China
State Grid Anhui Electric Power Institute, Hefei 230022, China
China Electric Power Research Institute, Beijing 100192, China
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Abstract

The dielectric capacitor has been widely used in advanced electronic and electrical power systems due to its capability of ultrafast charging-discharging and ultrahigh power density. Nevertheless, its energy density is still limited by the low dielectric constant (≈ 2.2) of the commercial dielectric polypropylene (PP). The conventional enhancement strategy by embedding inorganic fillers in PP matrix is still difficult and challenging due to that PP hardly dissolves in any inorganic/organic solvent. In this work, we develop a new strategy including freeze-drying, surface functionalization, and hot-pressing to incorporate Ti0.87O2 monolayers in PP film. A series of uniform composited Ti0.87O2@PP film has been successfully fabricated with Ti0.87O2 content range of 0-15 wt%. The maximum dielectric constant of the as-prepared Ti0.87O2@PP film is 3.27 when the Ti0.87O2 content is 9 wt%, which is about 1.5 times higher than that of pure PP. Our study provides a feasible strategy to embed two-dimensional material into commercial PP thin-film with superior dielectric performance for practical application.

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Journal of Advanced Ceramics
Pages 368-376

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Cite this article:
TIAN W, YAN F, CAI C, et al. Freeze-drying and hot-pressing strategy to embed two-dimensional Ti0.87O2 monolayers in commercial polypropylene films with enhanced dielectric properties. Journal of Advanced Ceramics, 2021, 10(2): 368-376. https://doi.org/10.1007/s40145-020-0443-0

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Received: 13 August 2020
Revised: 03 December 2020
Accepted: 05 December 2020
Published: 05 February 2021
© The Author(s) 2020

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