Journal Home > Volume 8 , Issue 4
Journal of Advanced Ceramics 2019, 8(4): 500-508 https://doi.org/10.1007/s40145-019-0330-8
Research Article | Open Access | Issue | Published: 04 December 2019

Unveiling the reaction products in heat treated Si3N4-Ti joined ceramics by transmission electron microscopy

Show Author's Information Orkun TUNCKANa,  Hilmi YURDAKULb,  Servet TURANc( )
Faculty of Aeronautics and Astronautics, Eskisehir Technical University, Eskisehir 26480, Turkey
Rafet Kayis Faculty of Engineering, Department of Metallurgical and Materials Engineering, Alanya Alaaddin Keykubat University, Alanya-Antalya 07450, Turkey
Faculty of Engineering, Department of Materials Science and Engineering, Eskisehir Technical University, Eskisehir 26480, Turkey
Keywords:
transmission electron microscopy (TEM), capacitor discharge joining (CDJ), Si3N4, Ti
Cite this article:
TUNCKAN O, YURDAKUL H, TURAN S. Unveiling the reaction products in heat treated Si3N4-Ti joined ceramics by transmission electron microscopy. Journal of Advanced Ceramics, 2019, 8(4): 500-508. https://doi.org/10.1007/s40145-019-0330-8
Download citation
EndNote(RIS)
BibTeX

669

Views

27

Downloads

Citations

8

Crossref

N/A

WoS

11

Scopus

2

CSCD

Abstract Full text About this article

Joining is a crucial process for the production of complex-shaped advanced engineering materials. Deep understanding of ceramic-metal interfaces during joining or following heat-treatment steps is therefore of important concern in designing the new systems. Capacitor discharge joining (CDJ) method was firstly carried out to compose the ceramic-metal joint material by silicon nitride (Si3N4)-titanium (Ti) constituents. Afterwards, heat treatment was performed on the Si3N4-Ti joints in air atmosphere at 1000 ℃ temperature to reveal the interface reactions and phases. Reaction layer that occurred between the Si3N4 and Ti interfaces and new phase formations were examined by transmission electron microscopy (TEM)-based various imaging and chemical analysis techniques. Electron transparent samples for TEM characterization were prepared by focused ion beam (FIB) milling and lifting method. Based on the detailed TEM results, Si and N diffusion arising from the Si3N4 ceramic was observed towards Ti metal foil side and further interacted with Ti atoms. The upshot of current diffusion was that Ti3N2 reaction layer with 50 nm thickness was formed at the interface while titanium silicon nitride (Ti6Si3N) matrix phase including dendritic-shaped Ti2N grains occurred in the Ti interlayer. It is believed that our TEM-based microscopy results not only provide the knowledge on ceramic-metal joint materials by CDJ method, but also contribute new insights on the development of various new joint systems.


menu
Abstract
Full text
Outline
About this article

Unveiling the reaction products in heat treated Si3N4-Ti joined ceramics by transmission electron microscopy

Show Author's information Orkun TUNCKANa, Hilmi YURDAKULb, Servet TURANc( )
Faculty of Aeronautics and Astronautics, Eskisehir Technical University, Eskisehir 26480, Turkey
Rafet Kayis Faculty of Engineering, Department of Metallurgical and Materials Engineering, Alanya Alaaddin Keykubat University, Alanya-Antalya 07450, Turkey
Faculty of Engineering, Department of Materials Science and Engineering, Eskisehir Technical University, Eskisehir 26480, Turkey

Abstract

Joining is a crucial process for the production of complex-shaped advanced engineering materials. Deep understanding of ceramic-metal interfaces during joining or following heat-treatment steps is therefore of important concern in designing the new systems. Capacitor discharge joining (CDJ) method was firstly carried out to compose the ceramic-metal joint material by silicon nitride (Si3N4)-titanium (Ti) constituents. Afterwards, heat treatment was performed on the Si3N4-Ti joints in air atmosphere at 1000 ℃ temperature to reveal the interface reactions and phases. Reaction layer that occurred between the Si3N4 and Ti interfaces and new phase formations were examined by transmission electron microscopy (TEM)-based various imaging and chemical analysis techniques. Electron transparent samples for TEM characterization were prepared by focused ion beam (FIB) milling and lifting method. Based on the detailed TEM results, Si and N diffusion arising from the Si3N4 ceramic was observed towards Ti metal foil side and further interacted with Ti atoms. The upshot of current diffusion was that Ti3N2 reaction layer with 50 nm thickness was formed at the interface while titanium silicon nitride (Ti6Si3N) matrix phase including dendritic-shaped Ti2N grains occurred in the Ti interlayer. It is believed that our TEM-based microscopy results not only provide the knowledge on ceramic-metal joint materials by CDJ method, but also contribute new insights on the development of various new joint systems.

Keywords: transmission electron microscopy (TEM), capacitor discharge joining (CDJ), Si3N4, Ti

References(41)

[1]
FL Riley. Silicon nitride and related materials. J Am Ceram Soc 2004, 83: 245-265.
DOI Google Scholar
[2]
MH Bocanegra-Bernal, B Matovic. Mechanical properties of silicon nitride-based ceramics and its use in structural applications at high temperatures. Mater Sci Eng 2010, 527: 1314-1338.
DOI Google Scholar
[3]
GM Zheng, J Zhao, ZJ Gao, et al. Cutting performance and wear mechanisms of SiAlON-Si3N4 graded nano-composite ceramic cutting tools. Int J Adv Manuf Technol 2012, 58: 19-28.
DOI Google Scholar
[4]
C Veiga, JP Davim, AJR Loureiro. Properties and applications of titanium alloys: a brief review. Rev Adv Mater Sci 2012, 32: 133-148.
Google Scholar
[5]
JR Myers, HB Bomberger, FH Froes. Corrosion behavior and use of titanium and its alloys. JOM 1984, 36: 50-60.
DOI Google Scholar
[6]
VN Chuvil'Deev, VI Kopylov, AV Nokhrin, et al. Study of mechanical properties and corrosive resistance of ultrafine-grained α-titanium alloy Ti-5Al-2V. J Alloys Compd 2017, 723: 354-367.
DOI Google Scholar
[7]
K Martinsen, SJ Hu, BE Carlson. Joining of dissimilar materials. Cirp Ann 2015, 64: 679-699.
DOI Google Scholar
[8]
MM Schwartz. Handbook of Structural Ceramics. New York: McGraw-Hill Press, 1992.
[9]
P Groche, S Wohletz, M Brenneis, et al. Joining by forming—A review on joint mechanisms, applications and future trends. J Mater Process Technol 2014, 214: 1972-1994.
DOI Google Scholar
[10]
M Morales-Pérez, L Ceja-Cárdenas. Interfacial charac-terization in the brazing of silicon nitride to niobium joining using a double interlayer. Mater Charact 2017, 131: 316-323.
DOI Google Scholar
[11]
R Asthana, M Singh, J Martinez-Fernandez. Joining and interface characterization of in situ reinforced silicon nitride. J Alloys Compd 2013, 552: 137-145.
DOI Google Scholar
[12]
JA Fernie, RAL Drew, KM Knowles. Joining of engineering ceramics. Int Mater Rev 2009, 54: 283-331.
DOI Google Scholar
[13]
M Maeda, R Oomoto, T Shibayanagi, et al. Solid-state diffusion bonding of silicon nitride using titanium foils. Metall and Mat Trans A 2003, 34: 1647-1656.
DOI Google Scholar
[14]
J Lemus, RAL Drew. Joining of silicon nitride with a titanium foil interlayer. Mater Sci Eng 2003, 352: 169-178.
DOI Google Scholar
[15]
R Koleňák, I Kostolný, M Kusý. Characterization of soldering alloy type Zn-In-Mg and the study of direct soldering of silicon and copper. Mater Sci Eng 2018, 712: 302-312.
DOI Google Scholar
[16]
R Kolenak. Study of direct soldering of silicon and copper substrate by use of Bi-based solders with lanthanides addition. Solder Surf Mo Technol 2017, 29: 121-132.
DOI Google Scholar
[17]
R Koleňák, I Kostolný, J Drápala, et al. Characterizing the soldering alloy type In-Ag-Ti and the study of direct soldering of SiC ceramics and copper. Metals 2018, 8: 274-290.
DOI Google Scholar
[18]
QL Huang, J Cai, W Pan, et al. In situ processing of TiN/Si3N4 composites by Ti-Si3N4 solid state reaction. Mater Lett 1997, 31: 221-225.
DOI Google Scholar
[19]
W Lengauer. A study of δ′-TiN1-x formation in temperature gradient diffusion couples. J Alloys Compd 1992, 179: 289-297.
DOI Google Scholar
[20]
M Paulasto, JK Kivilahti. Formation of interfacial microstructure in brazing of Si3N4 with Ti-activated Ag-Cu filler alloys. Scr Metall Et Mater 1995, 32: 1209-1214.
DOI Google Scholar
[21]
XY Ma, CR Li, WJ Zhang. The thermodynamic assessment of the Ti-Si-N system and the interfacial reaction analysis. J Alloys Compd 2005, 394: 138-147.
DOI Google Scholar
[22]
RF Zhang, S Veprek. On the spinodal nature of the phase segregation and formation of stable nanostructure in the Ti-Si-N system. Mater Sci Eng 2006, 424: 128-137.
DOI Google Scholar
[23]
S Sambasivan, WT Petuskey. Phase chemistry in the Ti-Si-N system: Thermochemical review with phase stability diagrams. J Mater Res 1994, 9: 2362-2369.
DOI Google Scholar
[24]
S Turan, IA Bucklow, ER Wallach. Capacitor-discharge joining of oxide ceramics. J Am Ceram Soc 2004, 82: 1242-1248.
DOI Google Scholar
[25]
O Tunckan, H Yurdakul, S Turan. Identification and quantification of reaction phases at Si3N4-Ti interfaces by using analytical transmission electron microscopy techniques. Ceram Int 2013, 39: 1087-1095.
DOI Google Scholar
[26]
S Turan, D Turan, IA Bucklow, et al. Microstructure of capacitor discharge joined SiAlON and silicon nitride ceramics. Inst Phys Conf 2001, 168: 319-322.
Google Scholar
[27]
K Takaki, Y Takada, M Itagaki, et al. Bonding strength of alumina tiles joined using capacitor discharge technique. Surf Coat Technol 2003, 169-170: 495-498.
DOI Google Scholar
[28]
O Tunçkan, D Turan, A Doğan, et al. Characterization of the interfaces formed at the silicon nitride superalloy joints. J Aust Ceram Soc 2017, 53: 83-89.
DOI Google Scholar
[29]
RK Yang, CS Zhu, Q Wei, et al. Investigations on structural, elastic, thermodynamic and electronic properties of TiN, Ti2N and Ti3N2 under high pressure by first-principles. J Phys Chem Solids 2016, 98: 10-19.
DOI Google Scholar
[30]
S Farè, N Lecis, M Vedani, et al. Properties of nitrided layers formed during plasma nitriding of commercially pure Ti and Ti-6Al-4V alloy. Surf Coat Technol 2012, 206: 2287-2292.
DOI Google Scholar
[31]
HJ Yu, FJ Sun. A modified embedded atom method interatomic potential for the Ti-N system. Phys B Condens Matter 2009, 404: 1692-1694.
DOI Google Scholar
[32]
TP Wang, CF Liu, C Leinenbach, et al. Microstructure and strengthening mechanism of Si3N4/Invar joint brazed with TiNp-doped filler. Mater Sci Eng 2016, 650: 469-477.
DOI Google Scholar
[33]
SC Mishra, BB Nayak, BC Mohanty, et al. Surface nitriding of titanium in arc plasma. J Mater Process Technol 2003, 132: 143-148.
DOI Google Scholar
[34]
JY Yang, JS Wu, W Hua. Study on mechanical alloying and subsequent heat treatment of the Ti-Si system. Phys B Condens Matter 2000, 279: 241-245.
DOI Google Scholar
[35]
HA Wriedt, JL Murray. The N-Ti (nitrogen-titanium) system. Bull Alloy Phase Diagrams 1987, 8: 378-388.
DOI Google Scholar
[36]
M Singh, R Asthana, FM Varela, et al. Microstructural and mechanical evaluation of a Cu-based active braze alloy to join silicon nitride ceramics. J Eur Ceram Soc 2011, 31: 1309-1316.
DOI Google Scholar
[37]
P Wei, J Chen, Y Huang. Titanium metallization of Si3N4 ceramics by molten salt reaction: Mechanism and interfacial structure. J Mater Sci 2000, 35: 3685-3689.
DOI Google Scholar
[38]
CF Liu, J Zhang, Y Zhou, et al. Effect of holding time on the self-joining of silicon nitride. J Alloys Compd 2009, 471: 217-221.
DOI Google Scholar
[39]
J Zhang, XM Zhang, Y Zhou, et al. Interfacial microstructure of Si3N4/Si3N4 brazing joint with Cu-Zn-Ti filler alloy. Mater Sci Eng 2008, 495: 271-275.
DOI Google Scholar
[40]
T Shimoo, K Okamura, S Adachi. Interaction of Si3N4 with titanium at elevated temperatures. J Mater Sci 1997, 32: 3031-3036.
DOI Google Scholar
[41]
W Lengauer, J Bauer, A Guillou, et al. WDS-EPMA Nitrogen profile determination in TiN/Ti diffusion couples using homotypic standard materials. Mikrochim Acta 1992, 107: 303-310.
DOI Google Scholar
Publication history
Copyright
Acknowledgements
Rights and permissions

Publication history

Received: 21 December 2018
Revised: 21 March 2019
Accepted: 08 April 2019
Published: 04 December 2019
Issue date: December 2019

Copyright

© The author(s) 2019

Acknowledgements

The authors would like to thank to Anadolu University (Eskisehir, Turkey) for financial support by BAP-030217 project. We would like to also give our gratitude to UNAM Laboratories of Bilkent University (Ankara, Turkey) for FIB analysis.

Rights and permissions

Open Access This article is licensed under a Creative Commons Attribution 4.0 International License, which permits use, sharing, adaptation, distribution and reproduction in any medium or format, as long as you give appropriate credit to the original author(s) and the source, provide a link to the Creative Commons licence, and indicate if changes were made.

The images or other third party material in this article are included in the article’s Creative Commons licence, unless indicated otherwise in a credit line to the material. If material is not included in the article’s Creative Commons licence and your intended use is not permitted by statutory regulation or exceeds the permitted use, you will need to obtain permission directly from the copyright holder.

To view a copy of this licence, visit http://creativecommons.org/licenses/by/4.0/.

Return