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Yttria stabilized zirconia (YSZ) film has been screen printed and sintered on a rigid substrate. The constrained sintering caused the formation of multiple microcracks and most critically large “blister” defects. The morphology of such defects has been characterized by scanning electron microscopy (SEM). It was revealed that the film surface exhibits noticeable roughness. Microhardness testing revealed little variation in green density distribution. Rheological measurement, however, showed that some agglomerations are present in the YSZ ink. The existence of agglomerations in the screen printing ink in combination with debonding at the film/substrate interface is potentially the cause for the formation of blister defects.


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Blister defect formation within partially stabilized zirconia film during constrained sintering

Show Author's information Kais HBAIEBa,b( )
Strategic Technology Unit, First Floor, Room G-08, Taibah University, P.O. Box 344, Al-Madinah Al-Munawwara, Kingdom of Saudi Arabia
Mechanical Department, College of Engineering, Taibah University, P.O. Box 344, Al-Madinah Al-Munawwara, Kingdom of Saudi Arabia

Abstract

Yttria stabilized zirconia (YSZ) film has been screen printed and sintered on a rigid substrate. The constrained sintering caused the formation of multiple microcracks and most critically large “blister” defects. The morphology of such defects has been characterized by scanning electron microscopy (SEM). It was revealed that the film surface exhibits noticeable roughness. Microhardness testing revealed little variation in green density distribution. Rheological measurement, however, showed that some agglomerations are present in the YSZ ink. The existence of agglomerations in the screen printing ink in combination with debonding at the film/substrate interface is potentially the cause for the formation of blister defects.

Keywords: defects, constrained sintering, yttria stabilized zirconia (YSZ), desintering, debonding

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Publication history

Received: 16 September 2014
Revised: 10 November 2014
Accepted: 11 November 2014
Published: 31 January 2015
Issue date: March 2015

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© The author(s) 2015

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Open Access: This article is distributed under the terms of the Creative Commons Attribution License which permits any use, distribution, and reproduction in any medium, provided the original author(s) and the source are credited.

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