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Journal of Advanced Ceramics 2014, 3(1): 71-75 https://doi.org/10.1007/s40145-014-0095-z
Research Article | Open Access | Issue | Published: 05 March 2014

Microstructure of reaction layer and its effect on the joining strength of SiC/SiC joints brazed using Ag–Cu–In–Ti alloy

Show Author's Information Yan LIU( ),  Yunzhou ZHU,  Yong YANG,  Xuejian LIU,  Zhengren HUANG
Key Laboratory of High Performance Ceramics and Superfine Microstructure of Shanghai Institute of Ceramics, Chinese Academy of Sciences, Shanghai 200050, P.R. China
Keywords:
microstructure, Ag–Cu–In–Ti, SiC/SiC joints, reaction layer, joining strength
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LIU Y, ZHU Y, YANG Y, et al. Microstructure of reaction layer and its effect on the joining strength of SiC/SiC joints brazed using Ag–Cu–In–Ti alloy. Journal of Advanced Ceramics, 2014, 3(1): 71-75. https://doi.org/10.1007/s40145-014-0095-z
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Abstract Full text About this article

The SiC/SiC joints were vacuum brazed at 700 ℃, 740 ℃, 780 ℃ and 800 ℃ for 10 min respectively, using Ag–Cu–In–Ti active filler alloy. The microstructure and joining strength of the joints were characterized by electron probe X-ray microanalyser (EPMA), energy dispersive spectroscopy (EDS), transmission electron microscopy (TEM) and four-point bending strength test. The interface of the joints was composed of three parts: SiC substrate, reaction layer and filler alloy. A representative microstructure of the reaction layer: In-containing layer/TiC layer/Ti5Si3 layer was found from the TEM image. The forming of the In-containing layer could be attributed to the crack or delamination of SiC/TiC interface. The In-containing layer intensified the coefficient of thermal expansion (CTE) mismatch of SiC and the reaction layer, and affected the joining strength. With the increase of the reaction layer's thickness, the joining strength firstly increased, then declined, and the maximum four-point bending strength reached 234 MPa.


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About this article

Microstructure of reaction layer and its effect on the joining strength of SiC/SiC joints brazed using Ag–Cu–In–Ti alloy

Show Author's information Yan LIU( ), Yunzhou ZHU, Yong YANG, Xuejian LIU, Zhengren HUANG
Key Laboratory of High Performance Ceramics and Superfine Microstructure of Shanghai Institute of Ceramics, Chinese Academy of Sciences, Shanghai 200050, P.R. China

Abstract

The SiC/SiC joints were vacuum brazed at 700 ℃, 740 ℃, 780 ℃ and 800 ℃ for 10 min respectively, using Ag–Cu–In–Ti active filler alloy. The microstructure and joining strength of the joints were characterized by electron probe X-ray microanalyser (EPMA), energy dispersive spectroscopy (EDS), transmission electron microscopy (TEM) and four-point bending strength test. The interface of the joints was composed of three parts: SiC substrate, reaction layer and filler alloy. A representative microstructure of the reaction layer: In-containing layer/TiC layer/Ti5Si3 layer was found from the TEM image. The forming of the In-containing layer could be attributed to the crack or delamination of SiC/TiC interface. The In-containing layer intensified the coefficient of thermal expansion (CTE) mismatch of SiC and the reaction layer, and affected the joining strength. With the increase of the reaction layer's thickness, the joining strength firstly increased, then declined, and the maximum four-point bending strength reached 234 MPa.

Keywords: microstructure, Ag–Cu–In–Ti, SiC/SiC joints, reaction layer, joining strength

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Publication history
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Publication history

Received: 10 September 2013
Revised: 31 December 2013
Accepted: 21 January 2014
Published: 05 March 2014
Issue date: March 2014

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© The author(s) 2014

Acknowledgements

The authors gratefully acknowledge the financial support from Chinese Academy of Sciences.

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Open Access: This article is distributed under the terms of the Creative Commons Attribution License which permits any use, distribution, and reproduction in any medium, provided the original author(s) and the source are credited.

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