Journal Home > Volume 3 , Issue 1
Journal of Advanced Ceramics 2014, 3(1): 71-75 https://doi.org/10.1007/s40145-014-0095-z
Research Article | Open Access | Issue | Published: 05 March 2014

Microstructure of reaction layer and its effect on the joining strength of SiC/SiC joints brazed using Ag–Cu–In–Ti alloy

Show Author's Information Yan LIU( ),  Yunzhou ZHU,  Yong YANG,  Xuejian LIU,  Zhengren HUANG
Key Laboratory of High Performance Ceramics and Superfine Microstructure of Shanghai Institute of Ceramics, Chinese Academy of Sciences, Shanghai 200050, P.R. China
Keywords:
microstructure, Ag–Cu–In–Ti, SiC/SiC joints, reaction layer, joining strength
Cite this article:
LIU Y, ZHU Y, YANG Y, et al. Microstructure of reaction layer and its effect on the joining strength of SiC/SiC joints brazed using Ag–Cu–In–Ti alloy. Journal of Advanced Ceramics, 2014, 3(1): 71-75. https://doi.org/10.1007/s40145-014-0095-z
Download citation
EndNote(RIS)
BibTeX

494

Views

18

Downloads

Citations

29

Crossref

N/A

WoS

30

Scopus

0

CSCD

Abstract Full text About this article

The SiC/SiC joints were vacuum brazed at 700 ℃, 740 ℃, 780 ℃ and 800 ℃ for 10 min respectively, using Ag–Cu–In–Ti active filler alloy. The microstructure and joining strength of the joints were characterized by electron probe X-ray microanalyser (EPMA), energy dispersive spectroscopy (EDS), transmission electron microscopy (TEM) and four-point bending strength test. The interface of the joints was composed of three parts: SiC substrate, reaction layer and filler alloy. A representative microstructure of the reaction layer: In-containing layer/TiC layer/Ti5Si3 layer was found from the TEM image. The forming of the In-containing layer could be attributed to the crack or delamination of SiC/TiC interface. The In-containing layer intensified the coefficient of thermal expansion (CTE) mismatch of SiC and the reaction layer, and affected the joining strength. With the increase of the reaction layer's thickness, the joining strength firstly increased, then declined, and the maximum four-point bending strength reached 234 MPa.


menu
Abstract
Full text
Outline
About this article

Microstructure of reaction layer and its effect on the joining strength of SiC/SiC joints brazed using Ag–Cu–In–Ti alloy

Show Author's information Yan LIU( ), Yunzhou ZHU, Yong YANG, Xuejian LIU, Zhengren HUANG
Key Laboratory of High Performance Ceramics and Superfine Microstructure of Shanghai Institute of Ceramics, Chinese Academy of Sciences, Shanghai 200050, P.R. China

Abstract

The SiC/SiC joints were vacuum brazed at 700 ℃, 740 ℃, 780 ℃ and 800 ℃ for 10 min respectively, using Ag–Cu–In–Ti active filler alloy. The microstructure and joining strength of the joints were characterized by electron probe X-ray microanalyser (EPMA), energy dispersive spectroscopy (EDS), transmission electron microscopy (TEM) and four-point bending strength test. The interface of the joints was composed of three parts: SiC substrate, reaction layer and filler alloy. A representative microstructure of the reaction layer: In-containing layer/TiC layer/Ti5Si3 layer was found from the TEM image. The forming of the In-containing layer could be attributed to the crack or delamination of SiC/TiC interface. The In-containing layer intensified the coefficient of thermal expansion (CTE) mismatch of SiC and the reaction layer, and affected the joining strength. With the increase of the reaction layer's thickness, the joining strength firstly increased, then declined, and the maximum four-point bending strength reached 234 MPa.

Keywords: microstructure, Ag–Cu–In–Ti, SiC/SiC joints, reaction layer, joining strength

References(18)

[1]
Wang J, Guo Q, Liu L, et al. The preparation and performance of high-temperature adhesives for graphite bonding. Int J Adhes Adhes 2005, 25: 495–501.
DOI Google Scholar
[2]
Halbig MC, Coddington BP, Asthana R, et al. Characterization of silicon carbide joints fabricated using SiC particulate-reinforced Ag–Cu–Ti alloys. Ceram Int 2013, 39: 4151–4162.
DOI Google Scholar
[3]
Cockeram BV. Flexural strength and shear strength of silicon carbide to silicon carbide joints fabricated by a molybdenum diffusion bonding technique. J Am Ceram Soc 2005, 88: 1892–1899.
DOI Google Scholar
[4]
Katoh Y, Kotani M, Kohyama A, et al. Microstructure and mechanical properties of low-activation glass-ceramic joining and coating for SiC/SiC composites. J Nucl Mater 2000, 283–287: 1262–1266.
DOI Google Scholar
[5]
Luo Z, Jiang D, Zhang J, et al. Development of SiC–SiC joint by reaction bonding method using SiC/C tapes as the interlayer. J Eur Ceram Soc 2012, 32: 3819–3824.
DOI Google Scholar
[6]
Tian W, Kita H, Hyuga H, et al. Reaction joining of SiC ceramics using TiB2-based composites. J Eur Ceram Soc 2010, 30: 3203–3208.
DOI Google Scholar
[7]
Nomura M, Ichimori T, Iwamoto , et al. Structure of wetting front in the Ag–Cu–Ti/SiC reactive system. J Mater Sci 2000, 35: 3953–3958.
DOI Google Scholar
[8]
Iwamoto C, Tanaka S-I. Atomic morphology and chemical reaction of the reactive wetting front. Acta Mater 2002, 50: 749–755.
DOI Google Scholar
[9]
Xiong J, Li J, Zhang F, et al. Joining of 3D C/SiC composites to niobium alloy. Scripta Mater 2006, 55: 151–154.
DOI Google Scholar
[10]
Li J, Liu L, Wu Y, et al. A high temperature Ti–Si eutectic braze for joining SiC. Mater Lett 2008, 62: 3135–3138.
DOI Google Scholar
[11]
Mao Y, Li S, Yan L. Joining of SiC ceramic to graphite using Ni–Cr–SiC powders as filler. Mat Sci Eng A 2008, 491: 304–308.
DOI Google Scholar
[12]
Mao Y, Mombello D, Baroni C. Wettability of Ni–Cr filler on SiC ceramic and interfacial reactions for the SiC/Ni–51Cr system. Scripta Mater 2011, 64: 1087–1090.
DOI Google Scholar
[13]
Singh M, Asthana R, Shpargel TP. Brazing of ceramic-matrix composites to Ti and Hastealloy using Ni-base metallic glass interlayers. Mat Sci Eng A 2008, 498: 19–30.
DOI Google Scholar
[14]
Xiong H-P, Mao W, Xie Y-H, et al. Control of interfacial reactions and strength of the SiC/SiC joints brazed with newly-developed Co-based brazing alloy. J Mater Res 2007, 22: 2727–2736.
DOI Google Scholar
[15]
Iseki T, Yano T, Chung Y-S. Wetting and properties of reaction products in active metal brazing of SiC. J Ceram Soc Jpn 1989, 97: 710–714.
DOI Google Scholar
[16]
López-Cuevas J, Rendón-Angeles JC, Rodríguez- Galicia JL, et al. High temperature chemical interaction between SSiC substrate and Ag–Cu based liquid alloys in vacuo. Mater Sci Forum 2006, 509: 111–116.
DOI Google Scholar
[17]
Iwamoto C, Tanaka S-I. Reactive wetting of Ag–Cu–Ti on SiC in HRTEM. Acta Mater 1998, 7: 2381–2386.
DOI Google Scholar
[18]
Liu Y, Huang ZR, Liu XJ. Joining of sintered silicon carbide using ternary Ag–Cu–Ti active brazing alloy. Ceram Int 2009, 35: 3479–3484.
DOI Google Scholar
Publication history
Copyright
Acknowledgements
Rights and permissions

Publication history

Received: 10 September 2013
Revised: 31 December 2013
Accepted: 21 January 2014
Published: 05 March 2014
Issue date: March 2014

Copyright

© The author(s) 2014

Acknowledgements

The authors gratefully acknowledge the financial support from Chinese Academy of Sciences.

Rights and permissions

Open Access: This article is distributed under the terms of the Creative Commons Attribution License which permits any use, distribution, and reproduction in any medium, provided the original author(s) and the source are credited.

Return