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High performance low temperature co-fired ceramic (LTCC) dielectrics is highly desired for next generation information technology. The rational design is a key issue for the development of new LTCC materials. In comparison to the design of conventional electroceramics, more attention should be paid on the formation process of the material structure for that of LTCC, in addition to the physical properties, due to the special requirement in fabrication processing. In this paper, sintering mechanism of three types of LTCC materials, i.e., glass-ceramics, glass ceramic composite, and glass bonded ceramics, as well as important factors of their dielectric properties are discussed and summarized, and the design strategies for LTCC dielectrics, based on new matrix materials with much lower sintering temperature or higher quality, are proposed. As an example for rational design, oxyfluoride glass-ceramic based dielectrics, a new class of LTCC materials with low εr, is analyzed.


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Towards rational design of low-temperature co-fired ceramic (LTCC) materials

Show Author's information Ji ZHOU*( )
State Key Laboratory of New Ceramics and Fine Processing, Tsinghua University, Beijing 100084, China

Abstract

High performance low temperature co-fired ceramic (LTCC) dielectrics is highly desired for next generation information technology. The rational design is a key issue for the development of new LTCC materials. In comparison to the design of conventional electroceramics, more attention should be paid on the formation process of the material structure for that of LTCC, in addition to the physical properties, due to the special requirement in fabrication processing. In this paper, sintering mechanism of three types of LTCC materials, i.e., glass-ceramics, glass ceramic composite, and glass bonded ceramics, as well as important factors of their dielectric properties are discussed and summarized, and the design strategies for LTCC dielectrics, based on new matrix materials with much lower sintering temperature or higher quality, are proposed. As an example for rational design, oxyfluoride glass-ceramic based dielectrics, a new class of LTCC materials with low εr, is analyzed.

Keywords:

LTCC, sintering, dielectric properties, material design
Received: 29 May 2012 Accepted: 07 June 2012 Published: 08 September 2012 Issue date: June 2012
References(60)
[1]
Baker A, Lanagan M, Randall C, et al. Integration concepts for the fabrication of LTCC structures. Int J Appl Ceram Technol 2005, 2: 514–520.
[2]
Wilcox DL, Huang R-F, Dai SX. Enabling materials for wireless multi-layer ceramic integrated circuit (MCIC) application. Ceram Trans 1999, 97: 201–213.
[3]
Sutono A, Heo D, Chen YE, et al. High-Q LTCC-based passive library for wireless system-on-package(SOP) module development. IEEE Trans Microw Theory Tech 2001, 49: 1715–1724.
[4]
Tang C-W, You S-F. Design methodologies of LTCC bandpass filters, diplexer, and triplexer with transmission zeros. IEEE Trans Microw Theory Tech 2006, 54: 717–723.
[5]
Lee C, Sutono A, Han S, et al. A compact LTCC-based Ku-band transmitter module. IEEE Trans Adv Packag 2002, 25: 374–384.
[6]
Imanaka Y. Multilayered Low Temperature Cofired Ceramics (LTCC) Technology. Germany: Springer, 2005.
[7]
Thelemann T, Thust H, Hintz M. Using LTCC for microsystems. Microelectron Int 2002, 19(3): 19–23.
[8]
Gongora-Rubioa MR, Espinoza-Vallejosb P, Sola-Lagunac L, et al. Overview of low temperature co-fired ceramics tape technology for meso-system technology (MsST). Sens Actuator A-Phys 2001, 89(3): 222–241.
[9]
Narang SB, Bahel S. Low loss dielectric ceramics for microwave applications: A review. J Ceram Process Res 2010, 11: 316–321.
[10]
Sebastian MT, Jantunen H. Low loss dielectric materials for LTCC applications: A review. Int Mater Rev 2008, 53: 57–90.
[11]
Dernovsek O, Eberstein M, Schiller WA. LTCC glass-ceramic composites for microwave application. J Eur Ceram Soc 2001, 21: 1693–1697.
[12]
Kita J, Moos R. Development of LTCC materials and their application-an review. J Microelectron Electron Compon Mater 2008, 38: 219–224.
[13]
Choi Y-J, Park J-H, Ko W-J, et al. Co-firing and shrinkage matching in low- and middle-permittivity dielectric dompositions for a low-temperature co-fired ceramics system. J Am Ceram Soc 2006, 89: 562–567.
[14]
Bienert C, Roosen A. Characterization and improvement of LTCC composite materials for application at elevated temperatures. J Eur Ceram Soc 2010, 30: 369–374.
[15]
Gong X, Chappell WJ, Katehi LPB. Multifunctional substrates for high-frequency applications. Microw Wirel Compon Lett 2003, 13: 428–430.
[16]
Eberstein M, Rabe T, Schiller WA. Influences of the glass phase on densification, microstructure, and properties of low-temperature co-fired ceramics. Int J Appl Ceram Technol 2006, 3: 428–436.
[17]
Jantunen H, Kangasvieri Vähäkangas TJ, Leppävuori S. Design aspects of microwave components with LTCC technique. J Eur Ceram Soc 2003, 23: 2541–2548.
[18]
Baker A, Lanagan M, Randall C, et al. Integration concepts for the fabrication of LTCC structures. Int J Appl Ceram Technol 2005, 2: 514–520.
[19]
Jones WK, Liu Y, Larsen B, et al. Chemical, structural, and mechanical properties of the LTCC tapes. Int J Microc Electron Packag 2000, 23(4): 469–473.
[20]
Valant M, Suvorov D. Chemical compatibility between silver electrodes and low-firing binary-oxide compounds: Conceptual study. J Am Ceram Soc 2000, 83: 2721–2729.
[21]
Ollagnier JB, Guillon O, Rödel J. Viscosity of LTCC determined by discontinuous sinter-forging. Int J ApplCeram Technol 2006, 3: 437–441.
[22]
Lu G-Q, Sutterlin RC, Gupta TK. Effect of mismatched sintering kinetics on camber in a low-temperature cofired ceramic package. J Am Ceram Soc 1993, 76: 1907–1914.
[23]
Mori N, Sugimoto Y, Harada J, et al. Dielectric properties of new glass-ceramics for LTCC applied to microwave or millimeter-wave frequencies. J Eur Ceram Soc 2006, 26(10-11): 1925–1928.
[24]
Rabe T, Gemeinert M, Schiller WA. Development of advanced low temperature cofired ceramics (LTCC). Key Eng Mater 2004, 264-268: 1181–1184.
[25]
Muralidhar AS, Shaikh GJ, Roberts DL, et al. Low dielectric low temperature fried glass ceramics. US Patent 5164342, 1992.
[26]
Hartmann HS. Crystallizable, low dielectric constant, low dielectric loss composition. US Patent 5024975, 1991.
[27]
Chung LL, Jenq GD, Bi SC. Low temperature sintering and crystallisation behaviour of low loss anorthite-based glass-ceramics. J Mater Sci 2003, 38: 693–698.
[28]
Chang CR, Jean JH. Crystallization kinetics and mechanism of low-dielectric, low-temperature, cofirable CaO-B2O3-SiO2 glass-Ceramics. J Am Ceram Soc 1999, 82: 1725–1732.
[29]
Shapiro AA, Kubota N, Yu K, et al. Stress testing of a recrystallizing CaO–B2O3–SiO2 glassceramic with Ag electrodes for high frequency electronic packaging. J Electron Mater, 2001, 30: 386–390.
[30]
Imanaka Y, Aoki S, Kamehara N, et al. Crystallization of low temperature fired glass/ceramic composite. J Ceram Soc Jpn 1987, 95: 1119–1121.
[31]
Imanaka Y, Yamazaki K, Aoki S, et al. Effect of alumina addition on crystallization of borosilicate glass. J Ceram Soc Jpn 1989, 97: 309–313.
[32]
Seo YJ, Jung JH, Cho YS, et al. Influences of particle size of alumina filler in an LTCC system. J Am Ceram Soc 2001, 90: 649–652.
[33]
Jean JH, Chang CR, Chang RL, et al. Effect of alumina particle size on prevention of crystal growth in low-k silica dielectric composite. Mater Chem Phys 1995, 40: 50–55.
[34]
Müller R, Meszaros R, Peplinski B, et al. Dissolution of alumina, sintering, and crystallization in glass ceramic composites for LTCC. J Am Ceram Soc 2009, 92: 1703–1708.
[35]
Wang HP, Xu SQ, Lu SQ, et al. Dielectric properties and microstructures of CaSiO3 ceramics with B2O3 addition. Ceram Int 2009, 35: 2715–2718.
[36]
Kim KS, Shim SH, Kim S, et al. Microwave dielectric properties of ceramic/glass composites with bismuth-zinc borosilicate glass. J Ceram Process Res 2010, 11: 47–51.
[37]
Dou G, Zhou D, Guo M, et al. Low-temperature sintered Zn2SiO4–CaTiO3 ceramics with near-zero temperature coefficient of resonant frequency. J Alloys Compd 2012, 513: 466–473.
[38]
Wang R, Zhou J, Zhao H. Oxyfluoride glass-silica ceramic composite for low temperature co-fired ceramics. J Eur Ceram Soc 2008, 28(15): 2877–2881.
[39]
Chen GH. Effect of replacement of MgO by CaO on sintering, crystallization and properties of MgO-Al2O3-SiO2 system glass-ceramics. J Mater Sci 2007, 42: 7239–7244.
[40]
Kim JR, Choi GK, Yim DK, et al. Thermal and dielectric properties of ZnO-B2O3-MO3 glasses (M = W, Mo). J Electroceram 2006, 17(1): 65–69.
[41]
Hsiang HI, His CH, Huang CC, et al. Sintering behavior and dielectric properties of BaTiO3 ceramics with glass addition for internal capacitor of LTCC. J Alloys Compd 2008, 459: 307–310.
[42]
Kwon K, Lanagan MT, Shrout TR. Synthesis of BaTiTe3O9 ceramics for LTCC application and its dielectric properties. J Ceram Soc Jpn 2005, 113: 216–219.
[43]
Tong JX, Zhang QL, Yang Y, et al. Low-temperature firing and microwave dielectric properties of Ca[(Li1/3Nb2/3)0.84Ti0.16]O3-δ ceramics for LTCC applications. J Am Ceram Soc 2007, 90: 845–849.
[44]
Knickerbocker SH, Kumar AH, Herron LW. Cordierite glass-ceramics for multilayer ceramic packaging. J Am Ceram Soc Bull 1993, 72: 90–95.
[45]
Lo CL, Duh JG, Chiou BS, et al. Low-temperature sintering and microwave dielectric properties of anorthite-based glass-ceramics. J Am Ceram Soc 2004, 85: 2230–2235.
[46]
Frenkel J. Kinetic Theory of Liquids. UK: Oxford University Press, 1946: 424.
[47]
Rao RRT. Ceramic and glass packaging in the 1990s. J Am Ceram Soc 1991, 74: 895–908.
[48]
Nishigaki S, Yano S, Fukuta J, et al. A new multilayered low-temperature-fired ceramic substrate. In: Proceedings of the 1985 International Symposium of Hybrid Microelectronics (ISHM). Anaheim, USA, 1985: 225–234.
[49]
Kuczynski GC, Zaplatynskyj I. Sintering of glass. J Am Ceram Soc 1956, 39: 349–350.
[50]
Cutler IB, Henrichsen RE. Effect of particle shape on the kinetics of sintering of glass. J Am Ceram Soc 1968, 51: 604–605.
[51]
Yue ZX, Yan J, Zhao F, et al. Low-temperature sintering and microwave dielectric properties of ZnTiO3-based LTCC materials. J Electroceram 2008, 21: 141–144.
[52]
Shin HS, Wang JH, Kim JH. Glass infilteration in bonding of BaTiO2 and Al2O3 layers. Mater Sci Forum 2007, 534-536: 1457–1460.
[53]
Kim MH, Lim JB, Kim JC, et al. Synthesis of BaCu(B2O5) ceramics and their effect on the sintering temperature and microwave dielectric properties of Ba(Zn1/3Nb2/3)O3 ceramics. J Am Ceram Soc 2006, 89: 3124–3128.
[54]
Kingery WD, Bowen HK, Uhlmann DR. Introduction to Ceramics. John Wiley& Sons Inc., 1976.
[55]
Imanaka Y. Material technology of LTCC for high frequency application. Mater Integr 2002, 15(12): 44–48.
[56]
Wang R, Zhou J, Li B, et al. CaF2-AlF3-SiO2 glass-ceramic with low dielectric constant for LTCC application. J Alloys Compd 2010, 490: 204–207.
[57]
Wang R, Zhou J, Li B, et al. Study of the properties of CaF2-AlF3-SiO2 oxyfluoride glass-ceramic system. Rare Met Mate Eng 2009, 38: 1117–1119.
[58]
Wang R, Zhou J, Huang XG, et al. Oxyfluoride glass-ceramic composites for low temperature co-fired ceramic substrate. Ferroelectrics 2009, 388: 31–35.
[59]
Zhou J, Wang R, Zhao HJ. Oxyfluoride glass-ceramic LTCC materials and their fabrication methods. Chinese Patent 200810056019.2.
[60]
Zhou J, Wang R, Li B, et al. A glass-ceramic composite LTCC material with tunable permittivity. Chinese Patent 201010174057.5.
Publication history
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Acknowledgements
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Publication history

Received: 29 May 2012
Accepted: 07 June 2012
Published: 08 September 2012
Issue date: June 2012

Copyright

© The author(s) 2012

Acknowledgements

This work was supported by the National Natural Science Foundation of China (Grant Nos. 90922025, 51032003, and 50921061), and National High Technology Research and Development Program of China (Grant No. 2012AA030403). The author thanks Prof. Li Longtu, Prof. Bo Li, and Dr. Rui Wang, for their cooperation in related work.

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