References(60)
[1]
Baker A, Lanagan M, Randall C, et al. Integration concepts for the fabrication of LTCC structures. Int J Appl Ceram Technol 2005, 2: 514–520.
[2]
Wilcox DL, Huang R-F, Dai SX. Enabling materials for wireless multi-layer ceramic integrated circuit (MCIC) application. Ceram Trans 1999, 97: 201–213.
[3]
Sutono A, Heo D, Chen YE, et al. High-Q LTCC-based passive library for wireless system-on-package(SOP) module development. IEEE Trans Microw Theory Tech 2001, 49: 1715–1724.
[4]
Tang C-W, You S-F. Design methodologies of LTCC bandpass filters, diplexer, and triplexer with transmission zeros. IEEE Trans Microw Theory Tech 2006, 54: 717–723.
[5]
Lee C, Sutono A, Han S, et al. A compact LTCC-based Ku-band transmitter module. IEEE Trans Adv Packag 2002, 25: 374–384.
[6]
Imanaka Y. Multilayered Low Temperature Cofired Ceramics (LTCC) Technology. Germany: Springer, 2005.
[7]
Thelemann T, Thust H, Hintz M. Using LTCC for microsystems. Microelectron Int 2002, 19(3): 19–23.
[8]
Gongora-Rubioa MR, Espinoza-Vallejosb P, Sola-Lagunac L, et al. Overview of low temperature co-fired ceramics tape technology for meso-system technology (MsST). Sens Actuator A-Phys 2001, 89(3): 222–241.
[9]
Narang SB, Bahel S. Low loss dielectric ceramics for microwave applications: A review. J Ceram Process Res 2010, 11: 316–321.
[10]
Sebastian MT, Jantunen H. Low loss dielectric materials for LTCC applications: A review. Int Mater Rev 2008, 53: 57–90.
[11]
Dernovsek O, Eberstein M, Schiller WA. LTCC glass-ceramic composites for microwave application. J Eur Ceram Soc 2001, 21: 1693–1697.
[12]
Kita J, Moos R. Development of LTCC materials and their application-an review. J Microelectron Electron Compon Mater 2008, 38: 219–224.
[13]
Choi Y-J, Park J-H, Ko W-J, et al. Co-firing and shrinkage matching in low- and middle-permittivity dielectric dompositions for a low-temperature co-fired ceramics system. J Am Ceram Soc 2006, 89: 562–567.
[14]
Bienert C, Roosen A. Characterization and improvement of LTCC composite materials for application at elevated temperatures. J Eur Ceram Soc 2010, 30: 369–374.
[15]
Gong X, Chappell WJ, Katehi LPB. Multifunctional substrates for high-frequency applications. Microw Wirel Compon Lett 2003, 13: 428–430.
[16]
Eberstein M, Rabe T, Schiller WA. Influences of the glass phase on densification, microstructure, and properties of low-temperature co-fired ceramics. Int J Appl Ceram Technol 2006, 3: 428–436.
[17]
Jantunen H, Kangasvieri Vähäkangas TJ, Leppävuori S. Design aspects of microwave components with LTCC technique. J Eur Ceram Soc 2003, 23: 2541–2548.
[18]
Baker A, Lanagan M, Randall C, et al. Integration concepts for the fabrication of LTCC structures. Int J Appl Ceram Technol 2005, 2: 514–520.
[19]
Jones WK, Liu Y, Larsen B, et al. Chemical, structural, and mechanical properties of the LTCC tapes. Int J Microc Electron Packag 2000, 23(4): 469–473.
[20]
Valant M, Suvorov D. Chemical compatibility between silver electrodes and low-firing binary-oxide compounds: Conceptual study. J Am Ceram Soc 2000, 83: 2721–2729.
[21]
Ollagnier JB, Guillon O, Rödel J. Viscosity of LTCC determined by discontinuous sinter-forging. Int J ApplCeram Technol 2006, 3: 437–441.
[22]
Lu G-Q, Sutterlin RC, Gupta TK. Effect of mismatched sintering kinetics on camber in a low-temperature cofired ceramic package. J Am Ceram Soc 1993, 76: 1907–1914.
[23]
Mori N, Sugimoto Y, Harada J, et al. Dielectric properties of new glass-ceramics for LTCC applied to microwave or millimeter-wave frequencies. J Eur Ceram Soc 2006, 26(10-11): 1925–1928.
[24]
Rabe T, Gemeinert M, Schiller WA. Development of advanced low temperature cofired ceramics (LTCC). Key Eng Mater 2004, 264-268: 1181–1184.
[25]
Muralidhar AS, Shaikh GJ, Roberts DL, et al. Low dielectric low temperature fried glass ceramics. US Patent 5164342, 1992.
[26]
Hartmann HS. Crystallizable, low dielectric constant, low dielectric loss composition. US Patent 5024975, 1991.
[27]
Chung LL, Jenq GD, Bi SC. Low temperature sintering and crystallisation behaviour of low loss anorthite-based glass-ceramics. J Mater Sci 2003, 38: 693–698.
[28]
Chang CR, Jean JH. Crystallization kinetics and mechanism of low-dielectric, low-temperature, cofirable CaO-B2O3-SiO2 glass-Ceramics. J Am Ceram Soc 1999, 82: 1725–1732.
[29]
Shapiro AA, Kubota N, Yu K, et al. Stress testing of a recrystallizing CaO–B2O3–SiO2 glassceramic with Ag electrodes for high frequency electronic packaging. J Electron Mater, 2001, 30: 386–390.
[30]
Imanaka Y, Aoki S, Kamehara N, et al. Crystallization of low temperature fired glass/ceramic composite. J Ceram Soc Jpn 1987, 95: 1119–1121.
[31]
Imanaka Y, Yamazaki K, Aoki S, et al. Effect of alumina addition on crystallization of borosilicate glass. J Ceram Soc Jpn 1989, 97: 309–313.
[32]
Seo YJ, Jung JH, Cho YS, et al. Influences of particle size of alumina filler in an LTCC system. J Am Ceram Soc 2001, 90: 649–652.
[33]
Jean JH, Chang CR, Chang RL, et al. Effect of alumina particle size on prevention of crystal growth in low-k silica dielectric composite. Mater Chem Phys 1995, 40: 50–55.
[34]
Müller R, Meszaros R, Peplinski B, et al. Dissolution of alumina, sintering, and crystallization in glass ceramic composites for LTCC. J Am Ceram Soc 2009, 92: 1703–1708.
[35]
Wang HP, Xu SQ, Lu SQ, et al. Dielectric properties and microstructures of CaSiO3 ceramics with B2O3 addition. Ceram Int 2009, 35: 2715–2718.
[36]
Kim KS, Shim SH, Kim S, et al. Microwave dielectric properties of ceramic/glass composites with bismuth-zinc borosilicate glass. J Ceram Process Res 2010, 11: 47–51.
[37]
Dou G, Zhou D, Guo M, et al. Low-temperature sintered Zn2SiO4–CaTiO3 ceramics with near-zero temperature coefficient of resonant frequency. J Alloys Compd 2012, 513: 466–473.
[38]
Wang R, Zhou J, Zhao H. Oxyfluoride glass-silica ceramic composite for low temperature co-fired ceramics. J Eur Ceram Soc 2008, 28(15): 2877–2881.
[39]
Chen GH. Effect of replacement of MgO by CaO on sintering, crystallization and properties of MgO-Al2O3-SiO2 system glass-ceramics. J Mater Sci 2007, 42: 7239–7244.
[40]
Kim JR, Choi GK, Yim DK, et al. Thermal and dielectric properties of ZnO-B2O3-MO3 glasses (M = W, Mo). J Electroceram 2006, 17(1): 65–69.
[41]
Hsiang HI, His CH, Huang CC, et al. Sintering behavior and dielectric properties of BaTiO3 ceramics with glass addition for internal capacitor of LTCC. J Alloys Compd 2008, 459: 307–310.
[42]
Kwon K, Lanagan MT, Shrout TR. Synthesis of BaTiTe3O9 ceramics for LTCC application and its dielectric properties. J Ceram Soc Jpn 2005, 113: 216–219.
[43]
Tong JX, Zhang QL, Yang Y, et al. Low-temperature firing and microwave dielectric properties of Ca[(Li1/3Nb2/3)0.84Ti0.16]O3-δ ceramics for LTCC applications. J Am Ceram Soc 2007, 90: 845–849.
[44]
Knickerbocker SH, Kumar AH, Herron LW. Cordierite glass-ceramics for multilayer ceramic packaging. J Am Ceram Soc Bull 1993, 72: 90–95.
[45]
Lo CL, Duh JG, Chiou BS, et al. Low-temperature sintering and microwave dielectric properties of anorthite-based glass-ceramics. J Am Ceram Soc 2004, 85: 2230–2235.
[46]
Frenkel J. Kinetic Theory of Liquids. UK: Oxford University Press, 1946: 424.
[47]
Rao RRT. Ceramic and glass packaging in the 1990s. J Am Ceram Soc 1991, 74: 895–908.
[48]
Nishigaki S, Yano S, Fukuta J, et al. A new multilayered low-temperature-fired ceramic substrate. In: Proceedings of the 1985 International Symposium of Hybrid Microelectronics (ISHM). Anaheim, USA, 1985: 225–234.
[49]
Kuczynski GC, Zaplatynskyj I. Sintering of glass. J Am Ceram Soc 1956, 39: 349–350.
[50]
Cutler IB, Henrichsen RE. Effect of particle shape on the kinetics of sintering of glass. J Am Ceram Soc 1968, 51: 604–605.
[51]
Yue ZX, Yan J, Zhao F, et al. Low-temperature sintering and microwave dielectric properties of ZnTiO3-based LTCC materials. J Electroceram 2008, 21: 141–144.
[52]
Shin HS, Wang JH, Kim JH. Glass infilteration in bonding of BaTiO2 and Al2O3 layers. Mater Sci Forum 2007, 534-536: 1457–1460.
[53]
Kim MH, Lim JB, Kim JC, et al. Synthesis of BaCu(B2O5) ceramics and their effect on the sintering temperature and microwave dielectric properties of Ba(Zn1/3Nb2/3)O3 ceramics. J Am Ceram Soc 2006, 89: 3124–3128.
[54]
Kingery WD, Bowen HK, Uhlmann DR. Introduction to Ceramics. John Wiley& Sons Inc., 1976.
[55]
Imanaka Y. Material technology of LTCC for high frequency application. Mater Integr 2002, 15(12): 44–48.
[56]
Wang R, Zhou J, Li B, et al. CaF2-AlF3-SiO2 glass-ceramic with low dielectric constant for LTCC application. J Alloys Compd 2010, 490: 204–207.
[57]
Wang R, Zhou J, Li B, et al. Study of the properties of CaF2-AlF3-SiO2 oxyfluoride glass-ceramic system. Rare Met Mate Eng 2009, 38: 1117–1119.
[58]
Wang R, Zhou J, Huang XG, et al. Oxyfluoride glass-ceramic composites for low temperature co-fired ceramic substrate. Ferroelectrics 2009, 388: 31–35.
[59]
Zhou J, Wang R, Zhao HJ. Oxyfluoride glass-ceramic LTCC materials and their fabrication methods. Chinese Patent 200810056019.2.
[60]
Zhou J, Wang R, Li B, et al. A glass-ceramic composite LTCC material with tunable permittivity. Chinese Patent 201010174057.5.