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Research Article

Encapsulated carbon nanotube array as a thermal interface material compatible with standard electronics packaging

Ruixiang Bai1,§, Yangbing Wei1,§, Jiyuan Xu3, Xiaobo Li1, Menglin Li1, Ziwen Zou1, Xinyan Huang4, Chengyu Liu5, Yiwei Sun2( ), Menglong Hao1( )
Key Laboratory of Energy Thermal conversion and control of Ministry of Education, National Engineering Research Center of Power Generation Control and Safety, School of Energy and Environment, Southeast University, Nanjing 210096, China
School of Materials Science and Engineering, School of Energy and Environment, Southeast University, Nanjing 210096, China
Nanjing Research Institute of Electronics Technology, Nanjing 210039, China
Research Centre for Fire Engineering, Hong Kong Polytechnic University, Kowloon 999077, Hong Kong, China
State Key Laboratory of Bioelectronics, School of Instrument Science and Engineering, Southeast University, Nanjing 210096, China

§ Ruixiang Bai and Yangbing Wei contributed equally to this work.

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Graphical Abstract

A transfer-and-encapsulate strategy is proposed to develop a standalone thermal interface material (TIM) by soldering vertically aligned carbon nanotubes arrays (VACNTs) to copper microfoil. Actual light emitting diode (LED) cooling experiments show low thermal resistance, good reliability, and clear advantages over state-of-the-art commercial TIMs with a 17 °C temperature reduction.

Abstract

Vertically aligned carbon nanotubes arrays (VACNTs) are a promising candidate for the thermal interface material (TIM) of next-generation electronic devices due to their attractive thermal and mechanical properties. However, the environment required for synthesizing VACNTs is harsh and severely incompatible with standard device packaging processes. VACNTs’ extremely low in-plane thermal conductivity also limits its performance for cooling hot spots. Here, using a transfer-and-encapsulate strategy, a two-step soldering method is developed to cap both ends of the VACNTs with copper microfoils, forming a standalone Cu-VACNTs-Cu sandwich TIM and avoiding the need to directly grow VACNTs on chip die. This new TIM is fully compatible with standard packaging, with excellent flexibility and high thermal conductivities in both in-plane and through-plane directions. The mechanical compliance behavior and mechanism, which are critical for TIM applications, are investigated in depth using in situ nanoindentation. The thermal performance is further verified in an actual light emitting diode (LED) cooling experiment, demonstrating low thermal resistance, good reliability, and achieving a 17 °C temperature reduction compared with state-of-the-art commercial TIMs. This study provides a viable solution to VACNTs’ longstanding problem in device integration and free-end contact resistance, bringing it much closer to application and solving the critical thermal bottleneck in next-generation electronics.

Keywords

thermal conductivitysandwich structurevertically aligned carbon nanotube arrays (VACNTs)thermal interface materials (TIMs)

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Nano Research
Volume 16 Issue 8,
August 2023
Pages 11389-11400
DOI: 10.1007/s12274-023-5872-y
Cite this article:
Bai R, Wei Y, Xu J, et al. Encapsulated carbon nanotube array as a thermal interface material compatible with standard electronics packaging. Nano Research, 2023, 16(8): 11389-11400. https://doi.org/10.1007/s12274-023-5872-y
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Received: 16 March 2023
Revised: 10 May 2023
Accepted: 24 May 2023
Published: 17 July 2023
© Tsinghua University Press 2023
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