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Tempering force with mercy: An innovative peri-implant ligament with combined osteointegration and energy-dissipation

Department of Chemistry, Tsinghua University, Beijing 100084, China
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Nano Research
Volume 15 Issue 5,
May 2022
Pages 4466-4467
DOI: 10.1007/s12274-021-4018-3

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Cite this article:
Wang X. Tempering force with mercy: An innovative peri-implant ligament with combined osteointegration and energy-dissipation. Nano Research, 2022, 15(5): 4466-4467. https://doi.org/10.1007/s12274-021-4018-3
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Received: 23 November 2021
Accepted: 23 November 2021
Published: 28 December 2021
© Tsinghua University Press and Springer-Verlag GmbH Germany, part of Springer Nature 2021