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Review Article

Electronics based on two-dimensional materials: Status and outlook

Senfeng Zeng1,§Zhaowu Tang1,§Chunsen Liu1,2Peng Zhou1( )
State Key Laboratory of ASIC and System, School of Microelectronics, Fudan University, Shanghai 200433, China
School of Computer Science, Fudan University, Shanghai 200433, China

§ Senfeng Zeng and Zhaowu Tang contributed equally to this work.

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Abstract

Since Moore’s law in the traditional semiconductor industry is facing shocks, More Moore and More than Moore are proposed as two paths to maintain the development of the semiconductor industry by adopting new architectures or new materials, in which the former is committed to the continued scaling of transistors for performance enhancement, and the latter pursues the realization of functional diversification of electronic systems. Two-dimensional (2D) materials are supposed to play an important role in these two paths. In More Moore, the ultimate thin thickness and the dangling-bond-free surface of 2D channels offer excellent gate electrostatics while avoiding the degradation of carrier mobility at the same time, so that the transistors can be further scaled down for higher performance. In More than Moore, devices based on 2D materials can well meet the requirements of electronic systems for functional diversity, like that they can operate at high frequency, exhibit excellent sensitivity to the changes in the surroundings at room temperature, have good mechanical flexibility, and so on. In this review, we present the application of 2D materials in More Moore and More than Moore domains of electronics, outlining their potential as a technological option for logic electronics, memory electronics, radio-frequency electronics, sensing electronics, and flexible electronics.

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Nano Research
Pages 1752-1767

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Cite this article:
Zeng S, Tang Z, Liu C, et al. Electronics based on two-dimensional materials: Status and outlook. Nano Research, 2021, 14(6): 1752-1767. https://doi.org/10.1007/s12274-020-2945-z
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Received: 01 May 2020
Revised: 08 June 2020
Accepted: 19 June 2020
Published: 13 July 2020
© Tsinghua University Press and Springer-Verlag GmbH Germany, part of Springer Nature