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Nonvolatile memory devices based on filamentary resistance switching (RS) areamong the frontrunners to fuel future devices and sensors of the internet of things (IoT) era. The capability of many metal-insulator-metal cells to switch between two distinctive resistive states in response to an external electrical stimulus has been demonstrated. Through years of selection, cells based on the drift of metal ions, namely conductive-bridge memory devices, have shown a wide range of applications with nanosecond switching speeds, nanometer scalability, high-density, and low power-consumption. However, for low (sub-10-μA) current operation, a critical challenge is still represented by programming variability and by the stability of the conductive filament over time. Here, by introducing the concept of reverse filament growth (RFG), we managed to control the structural reconfiguration of the conductive filament inside a memory cell with significant enhancements of each of the aforementioned properties. A first-in-class Cu-based switching device is demonstrated, with a dedicated stack that enabled us to systematically trigger RFG, thus tuning the device's properties. Along with nanosecond switching speeds, we achieved an endurance of up to 106 cycles with a 102 read window, with outstanding disturb immunity and optimal stability of the filament over time. Furthermore, by tuning the filament's shape, an excellent control of multi-level bit operations was achieved. Thus, this device offers high flexibility in memory applications.


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Voltage-controlled reverse filament growth boosts resistive switching memory

Show Author's information Attilio Belmonte1,§( )Umberto Celano1,§( )Zhe Chen1,2Janaki Radhaskrishnan1,3Augusto Redolfi1Sergiu Clima1Olivier Richard1Hugo Bender1Gouri Sankar Kar1Wilfried Vandervorst1,3Ludovic Goux1
MEC, Kapeldreef 75, B-3001, Heverlee (Leuven)Belgium
Institute of MicroelectronicsPeking UniversityBeijing100871China
Department of Physics and AstronomyKU LeuvenCelestijnenlaan200D3001Leuven, Belgium

§ Attilio Belmonte and Umberto Celano contributed equally to this work.

Abstract

Nonvolatile memory devices based on filamentary resistance switching (RS) areamong the frontrunners to fuel future devices and sensors of the internet of things (IoT) era. The capability of many metal-insulator-metal cells to switch between two distinctive resistive states in response to an external electrical stimulus has been demonstrated. Through years of selection, cells based on the drift of metal ions, namely conductive-bridge memory devices, have shown a wide range of applications with nanosecond switching speeds, nanometer scalability, high-density, and low power-consumption. However, for low (sub-10-μA) current operation, a critical challenge is still represented by programming variability and by the stability of the conductive filament over time. Here, by introducing the concept of reverse filament growth (RFG), we managed to control the structural reconfiguration of the conductive filament inside a memory cell with significant enhancements of each of the aforementioned properties. A first-in-class Cu-based switching device is demonstrated, with a dedicated stack that enabled us to systematically trigger RFG, thus tuning the device's properties. Along with nanosecond switching speeds, we achieved an endurance of up to 106 cycles with a 102 read window, with outstanding disturb immunity and optimal stability of the filament over time. Furthermore, by tuning the filament's shape, an excellent control of multi-level bit operations was achieved. Thus, this device offers high flexibility in memory applications.

Keywords: filamentary resistive switching, CBRAM, conductive bridge, negative set, reverse filament growth

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Publication history
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Acknowledgements

Publication history

Received: 08 October 2017
Revised: 21 December 2017
Accepted: 07 January 2018
Published: 02 February 2018
Issue date: August 2018

Copyright

© Tsinghua University Press and Springer-Verlag GmbH Germany, part of Springer Nature 2018

Acknowledgements

Acknowledgements

We acknowledge the partial funding by IMEC's Industrial Affiliation programs.

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