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Research Article

Impurity-induced formation of bilayered graphene on copper by chemical vapor deposition

Jun Li1,2Jianing Zhuang3Chengmin Shen1,4( )Yuan Tian1Yande Que1,2Ruisong Ma1,2Jinbo Pan1,2Yanfang Zhang1,2Yeliang Wang1,4Shixuan Du1,4Feng Ding3( )Hong-Jun Gao1,4( )
Beijing National Laboratory for Condensed Matter PhysicsInstitute of PhysicsChinese Academy of SciencesBeijing100190China
University of Chinese Academy of SciencesBeijing100049China
Institute of Textiles and ClothingHong Kong Polytechnic UniversityKowloon, Hong KongChina
Beijing Key Laboratory for Nanomaterials and NanodevicesBeijing100190China
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Abstract

High-quality single-layered and bilayered graphene (SLG and BLG) was synthesized on copper foil surfaces by controllable chemical vapor deposition (CVD). Impurity nanoparticles formed on the copper foil surface by hightemperature annealing were found to play a crucial role in the growth of BLG. Analysis of energy-dispersive spectrometry (EDS) data indicated that these nanoparticles consisted of silicon and aluminum. According to the inverted wedding cake model, these nanoparticles served as nucleation centers for BLG growth and the free space between a nanoparticle and graphene served as the center of C injection for the continuous growth of the adlayer beneath the top layer. By combining phase-field theory simulations, we confirmed the mechanism of BLG growth and revealed more details about it in comparison with SLG growth. For the first time, this study led to a complete understanding of the BLG growth mechanism from nucleation to continuous growth in the CVD process, and it has opened a door to the thickness-controllable synthesis of graphene.

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Nano Research
Pages 2803-2810

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Cite this article:
Li J, Zhuang J, Shen C, et al. Impurity-induced formation of bilayered graphene on copper by chemical vapor deposition. Nano Research, 2016, 9(9): 2803-2810. https://doi.org/10.1007/s12274-016-1169-8

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Received: 07 April 2016
Accepted: 02 June 2016
Published: 20 July 2016
© Tsinghua University Press and Springer-Verlag Berlin Heidelberg 2016