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Research Article

Two-dimensional Ni(OH)2 nanoplates for flexible on-chip microsupercapacitors

Hao Wu1,2Kai Jiang3( )Shaosong Gu1,Hong Yang2Zheng Lou1Di Chen4Guozhen Shen1( )
State Key Laboratory for Superlattices and MicrostructuresInstitute of SemiconductorsChinese Academy of SciencesBeijing100083China
The Key Laboratory of Resource Chemistry of Ministry of EducationShanghai Key Laboratory of Rare Earth Functional Materialsand Shanghai Municipal Education Committee Key Laboratory of Molecular Imaging Probes and SensorsShanghai Normal UniversityShanghai200234China
Institute & Hospital of Hepatobiliary SurgeryKey Laboratory of Digital Hepatobiliary Surgery of Chinese PLAChinese PLA Medical SchoolChinese PLA General HospitalBeijing100853China
School of Mathematics and PhysicsUniversity of Science and Technology BeijingBeijing100083China

Present address: China University of Mining & Technology, Beijing 100083, China

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Abstract

On-chip microsupercapacitors (MSCs) compatible with on-chip geometries of integrated circuits can be used either as a separate power supply in microelectronic devices or as an energy storage or energy receptor accessory unit. In this work, we report the fabrication of flexible two-dimensional Ni(OH)2 nanoplates-based MSCs, which achieved a specific capacitance of 8.80 F/cm3 at the scan rates of 100 mV/s, losing only 0.20% of its original value after 10, 000 charge/discharge cycles. Besides, the MSCs reached an energy density of 0.59 mWh/cm3 and a power density up to 1.80 W/cm3, which is comparable to traditional carbon-based devices. The flexible MSCs exhibited good electrochemical stability when subjected to bending at various conditions, illustrating the promising application as electrodes for wearable energy storage.

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Nano Research
Pages 3544-3552

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Cite this article:
Wu H, Jiang K, Gu S, et al. Two-dimensional Ni(OH)2 nanoplates for flexible on-chip microsupercapacitors. Nano Research, 2015, 8(11): 3544-3552. https://doi.org/10.1007/s12274-015-0854-3

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Received: 05 May 2015
Revised: 29 June 2015
Accepted: 05 July 2015
Published: 14 September 2015
© Tsinghua University Press and Springer‐Verlag Berlin Heidelberg 2015