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Research Article

Solution-processed copper nanowire flexible transparent electrodes with PEDOT: PSS as binder, protector and oxide-layer scavenger for polymer solar cells

Jianyu Chen1Weixin Zhou1Jun Chen1Yong Fan1Ziqiang Zhang1Zhendong Huang1Xiaomiao Feng1( )Baoxiu Mi1Yanwen Ma1 ( )Wei Huang1,2( )
Key Laboratory for Organic Electronics & Information Displays (KLOEID) and Institute of Advanced Materials (IAM)Nanjing University of Posts & Telecommunications (NUPT)Nanjing210046China
Jiangsu-Singapore Joint Research Center for Organic/Bio-Electronics & Information Displays and Institute of Advanced MaterialsNanjing Tech UniversityNanjing211816China
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Abstract

The easy oxidation and surface roughness of Cu nanowire (NW) films are the main bottlenecks for their usage in transparent conductive electrodes (TCEs). Herein, we have developed a facile and scaled-up solution route to prepare Cu NW-based TCEs by embedding Cu NWs into pre-coated smooth poly(3, 4-ethylenedioxythiophene): poly(styrenesulfonate) (PEDOT: PSS) films on poly(ethylene terephthalate) (PET) substrates. The so obtained Cu NW-PEDOT: PSS/PET films have low surface roughness (~70 nm in height), high stability toward oxidation and good flexibility. The optimal TCEs show a typical sheet resistance of 15 Ω·sq-1 at high transparency (76% at λ = 550 nm) and have been used successfully to make polymer (poly(3-hexylthiophene): phenyl-C61-butyric acid methyl ester) solar cells, giving an efficiency of 1.4%. The overall properties of Cu NW-PEDOT: PSS/PET films demonstrate their potential application as a replacement for indium tin oxide in flexible solar cells.

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Nano Research
Pages 1017-1025

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Cite this article:
Chen J, Zhou W, Chen J, et al. Solution-processed copper nanowire flexible transparent electrodes with PEDOT: PSS as binder, protector and oxide-layer scavenger for polymer solar cells. Nano Research, 2015, 8(3): 1017-1025. https://doi.org/10.1007/s12274-014-0583-z

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Received: 07 June 2014
Revised: 12 September 2014
Accepted: 13 September 2014
Published: 17 October 2014
© Tsinghua University Press and Springer-Verlag Berlin Heidelberg 2014