@article{LIU2026, 
author = {Ting-xuan LIU and Jia-Li BIAN and Feng CAO and Xu-Dong XIA and Tong ZHU and Hai-Jun ZHANG and Ming-Chao WANG},
title = {Preparation and Properties of Neodymium-Modified High-Temperature Resistant Phosphoaluminate Adhesive},
year = {2026},
journal = {Advanced Ceramics},
volume = {47},
number = {5},
pages = {514-527},
keywords = {High-temperature Resistant Adhesive, Aluminum Phosphate, Neodymium Oxide, Bonding Property, Thermal Cycling Resistance},
url = {https://www.sciopen.com/article/10.16253/j.cnki.37-1226/tq.2026.05.007},
doi = {10.16253/j.cnki.37-1226/tq.2026.05.007},
abstract = {To address the drawbacks of conventional aluminum phosphate high-temperature adhesives, including mismatched thermal expansion coefficients with alumina ceramics and severe performance degradation after repeated high-low temperature thermal cycles, neodymium doping was utilized to modify and optimize the aluminum phosphate-based adhesive in this work. Systematic mechanical property tests identified the optimal molar ratio of Nd/Al as 3:7. Combined with physical property characterization, phase evolution investigation and microstructure observation, the thermal reaction and bonding mechanisms of the modified adhesive were revealed. Upon high-temperature heat treatment, massive crystallization of AlPO4 and NdPO4 occurs above 900℃, giving rise to grain boundary pinning and dispersion strengthening effects. At 1300℃, a multi-phase skeleton consisting of monoclinic NdPO4, orthorhombic AlPO4 and orthorhombic Al5BO9 is constructed, which remarkably enhances the high-temperature mechanical performance and thermal stability of the adhesive. The bonding strength of the modified adhesive sintered at 1300℃ reaches 44.5MPa, representing a 92.6% improvement compared with the unmodified sample. After 20 thermal cycles between room temperature and 1300℃, the residual bonding strength is 27.89MPa with a retention rate of approximately 68.4%, demonstrating significantly improved thermal cycling resistance. Moreover, the thermal expansion coefficient of the modified adhesive stabilizes at (7–7.5)×10-6K-1, achieving greatly improved compatibility with alumina ceramics whose thermal expansion coefficient is 8.5×10-6K-1. The as-prepared modified adhesive can meet the service requirements of aerospace and other high-temperature industries, and provides experimental foundations for the further development and application of aluminum phosphate high-temperature resistant adhesives.}
}