@article{Song2026, 
author = {Zi-Hao Song and Wei-Bin Wang and Xiao-Hui Liu and Xiao-Min Han and Yi Zhou and Rui Huang and Yan-Xia Jiang and Zhe Li and Xiao-Wei Liu and Mei-Ling Xiao and Hong-Gang Liao and Wei-Lin Xu and Rong Sun},
title = {Triphenylmethane-Derived Levelers for High-Speed Redistribution Layer Copper Electroplating of Tailored Surface Morphologies},
year = {2026},
journal = {Journal of Electrochemistry},
volume = {32},
number = {2},
keywords = {Redistribution layer, Copper electroplating leveler, Theoretical computation, In situ spectroelectrochemical analysis, Microstructural characterization},
url = {https://www.sciopen.com/article/10.61558/2993-074X.3591},
doi = {10.61558/2993-074X.3591},
abstract = {Redistribution Layer (RDL), composed of layered dielectrics and electroplated copper materials, is a basic structure to rearrange numerous I/O pads on the chip surface in wafer-level advanced packaging. As the key chemicals in electrolyte baths, electroplating additives have undergone continuous development to meet the industrial needs for high-speed and fine-line/fine-pitch applications. Meanwhile, the intricate relationships between additive chemical structures and electroplated copper properties are yet to be well understood. In this work, a pair of triphenylmethane-based dye molecules, i.e., gentian violet (GV) and methyl green (MG), was comparatively investigated as levelers for high-speed RDL copper electroplating. Compared to GV, significantly stronger electrochemical polarization and tunable deposit morphology can be achieved by MG with just one extra quaternized amine terminal. Combining quantum chemical computations, in situ spectroelectrochemical analyses, and microstructural characterization, it is found that MG possesses enhanced electrostatic adsorption, surface coverage and multi-additive synergies, enabling tailored copper trace morphology. This study elaborates the adsorption mechanism and screening criteria of triphenylmethane-derived levelers, and presents a candidate additive structure for high-speed copper electroplating.}
}