@article{Wang2026, 
author = {Heyan Wang and Jianghai He and Yingzheng Ren and Huan Liu and Yibin Jin and Yilei Zhang and Zhengang Lu and Jiubin Tan},
title = {Conformal ultra-thin, ultra-uniform metal films fabricated on non-planar substrates for advanced optoelectronics},
year = {2026},
journal = {International Journal of Extreme Manufacturing},
volume = {8},
number = {3},
keywords = {conformal ultra-thin metal, curved transparent conducting films, high transparency, conformal deposition method, metal co-doping},
url = {https://www.sciopen.com/article/10.1088/2631-7990/ae3651},
doi = {10.1088/2631-7990/ae3651},
abstract = {Transparent conducting films are indispensable to modern optoelectronic devices due to their unique combination of high transparency and electrical conductivity. While existing fabrication methods—such as physical vapor deposition and solution-based synthesis—are well-established for flat substrates, producing high-quality transparent conductors on non-planar surfaces remains a significant challenge, largely due to difficulties in achieving conformal coverage, nanoscale uniformity, and consistent optoelectrical performance. In this study, we report a conformal deposition model with metal co-doping method on curved surfaces that can produce ultra-thin (≤10 nm), ultra-uniform (±0.5 nm), and ultra-smooth metal films. This work sets a new benchmark for conformal sub-10 nm metal films, whose optoelectrical performance rivals that of planar counterparts, achieving an average visible transmittance of ~88% and sheet resistance of ~8.1 Ω·sq−1 with capping layers. In addition, the process can be further extended to a range of optical dielectrics, enabling precise production of advanced conformal coatings. These findings provide practical pathways for optoelectronic applications, including curved transparent electrodes, three-dimensional optical-to-microwave devices, and next-generation smart glasses.}
}