TY  - JOUR
AU  - Wang, Heyan
AU  - He, Jianghai
AU  - Ren, Yingzheng
AU  - Liu, Huan
AU  - Jin, Yibin
AU  - Zhang, Yilei
AU  - Lu, Zhengang
AU  - Tan, Jiubin
PY  - 2026
TI  - Conformal ultra-thin, ultra-uniform metal films fabricated on non-planar substrates for advanced optoelectronics
JO  - International Journal of Extreme Manufacturing
SN  - 2631-8644
VL  - 8
IS  - 3
AB  - Transparent conducting films are indispensable to modern optoelectronic devices due to their unique combination of high transparency and electrical conductivity. While existing fabrication methods—such as physical vapor deposition and solution-based synthesis—are well-established for flat substrates, producing high-quality transparent conductors on non-planar surfaces remains a significant challenge, largely due to difficulties in achieving conformal coverage, nanoscale uniformity, and consistent optoelectrical performance. In this study, we report a conformal deposition model with metal co-doping method on curved surfaces that can produce ultra-thin (≤10 nm), ultra-uniform (±0.5 nm), and ultra-smooth metal films. This work sets a new benchmark for conformal sub-10 nm metal films, whose optoelectrical performance rivals that of planar counterparts, achieving an average visible transmittance of ~88% and sheet resistance of ~8.1 Ω·sq−1 with capping layers. In addition, the process can be further extended to a range of optical dielectrics, enabling precise production of advanced conformal coatings. These findings provide practical pathways for optoelectronic applications, including curved transparent electrodes, three-dimensional optical-to-microwave devices, and next-generation smart glasses.
UR  - https://doi.org/10.1088/2631-7990/ae3651
DO  - 10.1088/2631-7990/ae3651