@article{CHEN2026, 
author = {Hongxia CHEN and Tongzhi RONG and Jiawei LI and Shouhang BEI and Qingchao LÜ},
title = {Cellular Automaton Simulation Analysis of Gas-Liquid Interface Corrosion of Metallic Copper},
year = {2026},
journal = {Journal of South China University of Technology (Natural Science Edition)},
volume = {54},
number = {5},
pages = {127-137},
keywords = {gas-liquid interface, cellular automaton, interface corrosion, contact angle, hydrolysis},
url = {https://www.sciopen.com/article/10.12141/j.issn.1000-565X.250173},
doi = {10.12141/j.issn.1000-565X.250173},
abstract = {Due to the high-density particle distribution and the complex physicochemical properties at the interface, corrosion of metals in the gas-liquid biphasic interfacial region exhibits distinct characteristics compared with single-phase full immersion corrosion. Experimental investigations face difficulties in accurately defining regional boundaries and performing localized monitoring, resulting in relatively limited research on gas-liquid interface corrosion. Based on accurate distribution of particles in a sodium chloride solution and oxygen at the interface, and incorporating the chemical reaction mechanisms, acidic autocatalytic mechanisms, and deposit blocking mechanisms that occur during actual corrosion processes, this study assigns different reaction probabilities and rules to various particles and establishes a two-dimensional cellular automaton corrosion model for the gas-liquid interface of metallic copper. The reaction kinetics, stabilized corrosion pit depth, and product distribution in the interfacial region of metallic copper under different contact angles are comparatively analyzed. The results show that the interfacial corrosion region of metallic copper can be divided into a diffusion zone controlled by chlorine and oxygen, and a thin liquid-film zone dominated by chloride ions. When the contact angle decreases from 72° to 18°, the area of the interface region increases to 3.2 times, and the dissolved oxygen content in the interfacial region correspondingly increases severalfold. Comparing the corrosion differences between the thin liquid film zone and the diffusion zone, it is found that at a contact angle of 18°, oxygen corrosion in the diffusion zone is the dominant control mechanism for interface corrosion; at contact angles of 27° and 45°, chlorine corrosion in the thin liquid film zone is the primary control mechanism; and at large contact angles (63° and 72°), corrosion is jointly controlled by chlorine and oxygen. These findings reveal that the severe corrosion in the gas-liquid interfacial region of metallic copper is caused by the bidirectional accumulation of corrosive ions from the liquid phase and dissolved oxygen from the gas phase. Furthermore, monitoring of H+ concentration within the pits demonstrated that, with the generation of H+and the occurrence of metal autocatalytic reactions, the metallic copper interface at a contact angle of 18° exhibits the largest corrosion area, the longest corrosion duration, and the most severe corrosion.}
}