@article{Zheng2026, 
author = {Sicong Zheng and Xinpeng Wang and Buhang Cheng and Xiaofeng Song and Chang Shi and Qin Li and Yanyan Dong and Chengjin Wu and Junwei Deng and Pengbo Bian and Guanqiang Song and Junfeng Wang and Peitao Liu and Luzhao Sun and Zhongfan Liu},
title = {Modular assembly of graphene-skinned Cu(111) foils into large-scale laminates with tailored interfaces and enhanced conductivity},
year = {2026},
journal = {Nano Research},
keywords = {chemical vapor deposition, conductivity, thermal management, single-crystal Cu(111), graphene-copper composites},
url = {https://www.sciopen.com/article/10.26599/NR.2026.94908969},
doi = {10.26599/NR.2026.94908969},
abstract = {Graphene-copper composites hold great promise for thermal and electrical management, yet their deployment is hindered by high grain boundary density, weak interfacial coupling, and limited scalability. Here we report a modular assembly strategy that transforms A3-sized single-crystalline graphene-skinned Cu(111) foils into bulk laminates with tailored interfaces and enhanced transport properties. The building blocks are synthesized via industrial-scale CVD system, combining temperature-gradient annealing with graphene epitaxial growth. Orientation-controlled stacking followed by spark plasma sintering yields dense laminates featuring only low-angle grain boundaries (<2°), preserved coherent Gr(0001)/Cu(111) interfaces, and a continuous graphene channel. The laminates achieve electrical conductivity up to 103.7% IACS and thermal conductivity exceeding 422.3 W·m-1·K-1, representing improvements of 5.5% and 8.2% respectively compared to commercial copper. Integrated heat spreaders exhibit substantially reduced thermal resistance (0.88 °C/W) with excellent stability. Extending this strategy to Gr/Ni(111) enables Cu-Gr-Ni heterostructures where graphene prevents intermetallic alloying. This work establishes a scalable paradigm for assembling macroscopic architectures from single-crystal, graphene-skinned building blocks for high-performance electronic packaging and multifunctional composites.}
}