@article{DONG2011, 
author = {Changdao DONG and Qiang ZHOU and Yici CAI and Dawei LIU},
title = {Partition-Based Global Placement Considering Wire-Density Uniformity for CMP Variations},
year = {2011},
journal = {Tsinghua Science and Technology},
volume = {16},
number = {1},
pages = {41-50},
keywords = {partitioning, placement, chemical-mechanical polishing (CMP), design for manufacturing (DFM), wire-density},
url = {https://www.sciopen.com/article/10.1016/S1007-0214(11)70007-4},
doi = {10.1016/S1007-0214(11)70007-4},
abstract = {This paper presents a multilevel hypergraph partitioning method that balances constraints on not only the cell area but also the wire weight with a partition-based global placement algorithm that maximizes the wire density uniformity to control chemical-mechanical polishing (CMP) variations. The multilevel partitioning alternately uses two FM variants in the refinement stage to give a more uniform wire distribution. The global placement is based on a top-down recursive bisection framework. The partitioning algorithm is used in the bisectioning to impact the wire density uniformity. Tests show that, with a 10% constraint, the partitioning produces solutions with more balanced edge weights that are 837% better than from hMetis, 1039.1% better than MLPart, and 762.9% better than FM in terms of imbalance proportion and that this global placement algorithm improves ROOSTER with a more uniform wire distribution by 3.1% on average with an increased wire length of only 3.0%.}
}