@article{Li2026, 
author = {Shuang Li and Jianyu Zhou and Miao Miao and Kunpeng Qian and Jianhui Fang and Xin Feng},
title = {Ti3C2Tx MXene-mediated sensitization-metallization enables sandwich-structured copper@aramid films for high-performance electromagnetic interference shielding},
year = {2026},
journal = {Nano Research},
volume = {19},
number = {3},
pages = {94908304},
keywords = {thermal conductivity, electromagnetic interference (EMI) shielding, Ti3C2Tx MXene, electroless deposition, sandwich-structured film},
url = {https://www.sciopen.com/article/10.26599/NR.2025.94908304},
doi = {10.26599/NR.2025.94908304},
abstract = {Optimizing the structural design of electromagnetic interference (EMI) shielding materials to enhance their effectiveness, mechanical properties, and thermal management remains a significant challenge. In this work, a sandwich-structured copper@aramid nanofiber/Ti3C2Tx MXene (Cu@ANF/MXene) composite film with high mechanical strength and thermal conductivity was achieved via a straightforward electroless deposition process. Crucially, Ti3C2Tx MXene serves dual roles: reinforcing the ANF matrix and sensitizing the formation of Ag seeds to facilitate subsequent Cu deposition, rather than merely acting as a conductive filler. The sandwich-structured film achieves an exceptional maximum EMI shielding effectiveness of 102.7 dB, while simultaneously integrating robust mechanical properties (149.7 MPa) and superior thermal conductivity (40.7 W·m−1·K−1). Remarkably, the sandwich-structured film exhibits a 34.5 dB enhancement in EMI shielding effectiveness compared to its non-sandwich counterpart under identical conditions, unequivocally demonstrating the critical importance of architectural optimization. This multifunctional performance underscores the significant potential of the metal@aramid composites for advanced EMI shielding applications.}
}