@article{Bai2026, 
author = {Linghan Bai and Shijiao Zhang and Zhibiao Ma and Lvye Dou and Jianqiang Li},
title = {Bio-inspired multifunctional composite phase change films for synergistic thermal management and microwave absorption},
year = {2026},
journal = {Nano Research},
volume = {19},
number = {5},
pages = {94908229},
keywords = {phase change materials, microwave absorption, thermal management, nacre-inspired structure, hierarchical multidimensional encapsulation},
url = {https://www.sciopen.com/article/10.26599/NR.2025.94908229},
doi = {10.26599/NR.2025.94908229},
abstract = {Wearable electronics devices face dual challenges of thermal failure and electromagnetic interference (EMI). While phase change materials (PCMs) offer efficient thermal management material, their inherent limitations-low thermal conductivity, rigidity, and limited electromagnetic loss hinder practical applications. Flexible composite PCMs (FCPCMs) with multifunctional integration present a promising solution. Herein, mimicking the lamellar “brick-and-mortar” architecture of natural nacre, a flexible phase-change composite film featuring a multidimensional hierarchical encapsulation structure is ingeniously engineered for synchronous thermal management and microwave absorption. This bioinspired design incorporates polyethylene glycol (PEG) within a robust scaffold of one-dimensional (1D) aramid nanofibers (ANFs), zero-dimensional (0D) nanodiamonds (NDs), and two-dimensional (2D) single-layer graphene (SG), bonded by waterborne polyurethane (WPU). The resulting nacre-mimetic, multidimensional architecture ensures exceptional encapsulation of PEG, effectively suppressing leakage while maintaining high phase-change cycling stability (> 300 cycles). The optimized composite achieves synergistic performance: enhances thermal conductivity (1.13 W/(m·K)), strong microwave absorption performance (−41.36 dB), high phase-change enthalpy (104 J/g), and mechanical performance (tensile strength: 15.10 MPa). This work provides a platform for next-generation smart thermal-regulation systems and anti-interference electronics.}
}