@article{Patel2024, 
author = {Dipak Patel and Akiyoshi Matsumoto and Hiroaki Kumakura and Yuka Hara and Toru Hara and Minoru Maeda and Hao Liang and Yusuke Yamauchi and Seyong Choi and Jung Ho Kim and Md Shahriar A. Hossain},
title = {Superconducting joints using reacted multifilament MgB2 wires: A technology toward cryogen-free MRI magnets},
year = {2024},
journal = {Journal of Magnesium and Alloys},
volume = {12},
number = {1},
pages = {159-170},
keywords = {MgB2 superconducting joint, MgB2 conductor, MRI applications, Cryogen-free magnet, Persistent-mode operation},
url = {https://www.sciopen.com/article/10.1016/j.jma.2023.11.014},
doi = {10.1016/j.jma.2023.11.014},
abstract = {The development of superconducting joining technology for reacted magnesium diboride (MgB2) conductors remains a critical challenge for the advancement of cryogen-free MgB2-based magnets for magnetic resonance imaging (MRI). Herein, the fabrication of superconducting joints using reacted carbon-doped multifilament MgB2 wires for MRI magnets is reported. To achieve successful superconducting joints, the powder-in-mold method was employed, which involved tuning the filament protection mechanism, the powder compaction pressure, and the heat treatment condition. The fabricated joints demonstrated clear superconducting-to-normal transitions in self-field, with effective magnetic field screening up to 0.5 T at 20 K. To evaluate the interface between one of the MgB2 filaments and the MgB2 bulk within the joint, serial sectioning was conducted for the first time in this type of superconducting joint. The serial sectioning revealed space formation at the interface, potentially caused by the volume shrinkage associated with the MgB2 formation or the combined effect of the volume shrinkage and the different thermal expansion coefficients of the MgB2 bulk, the filament, the mold, and the sealing material. These findings are expected to be pivotal in developing MgB2 superconducting joining technology for MRI magnet applications through interface engineering.}
}