TY  - JOUR
AU  - YAO, Zhongying
AU  - CHANG, Yiwen
AU  - CUI, Ge
AU  - ZHANG, Hongbo
AU  - REN, Ruikang
AU  - REN, Jiale
AU  - KUANG, Fenghua
PY  - 2023
TI  - Research Status of Ceramic Substrate Polishing Technologies
JO  - Journal of Ceramics
SN  - 2095-784X
SP  - 1093
EP  - 1102
VL  - 44
IS  - 6
AB  - With the rapid development of integrated circuit and semiconductor industries, ceramic substrates with high surface accuracy and low roughness have become the best choice for packaging substrates, where the polishing process, as the most critical step in the production process, determines the overall quality of the of ceramic substrates. Focusing on the basic principles and application scope of common polishing technologies for ceramic substrates, including chemical mechanical polishing, abrasive flow polishing, ultrasonic vibration assisted abrasive flow polishing, electrophoretic polishing, electrolytic polishing, and magnetorheological polishing, this paper was aimed to summarize the commonly used polishing technologies and their research status for ceramic substrates, such as alumina, silicon nitride, silicon carbide, beryllium oxide and aluminum nitride. Besides, the development trend of ceramic substrate polishing technology will be discussed.
UR  - https://doi.org/10.13957/j.cnki.tcxb.2023.06.004
DO  - 10.13957/j.cnki.tcxb.2023.06.004