@article{YANG2024, 
author = {Dawei YANG and Yao YAO and Lin JIANG},
title = {Research Progress in Thermally-conductive and Insulating Ceramic Fillers for Thermal Interface},
year = {2024},
journal = {Journal of Ceramics},
volume = {45},
number = {1},
pages = {58-71},
keywords = {ceramic fillers, thermal interface, thermal conductivity, insulation},
url = {https://www.sciopen.com/article/10.13957/j.cnki.tcxb.2024.01.005},
doi = {10.13957/j.cnki.tcxb.2024.01.005},
abstract = {Thermal interface materials with high thermal conductivity and insulation are important materials to support the efficient operation of electrical equipment and improve their service life. Polymer-based thermal interface materials have a poor intrinsic thermal conductivity. By adding insulating ceramic fillers with high thermal conductivity, a three-dimensional thermal network could be constructed to polymer matrix composites with greatly improved thermal conductivity. The research status and existing problems of oxides, nitrides, carbides and composite ceramic fillers in recent years, were summarize, while the future development direction and research focus of high thermal conductivity ceramic fillers are prospected.}
}