@article{HAN2024, 
author = {Wen HAN and Zhenheng YANG and Xudong SUI and Lei XU and Shijin ZENG and Shengrui YU and Han XU},
title = {Influence of Single Grinding Head Ceramic Tile Polishing Process Parameters on Grinding Uniformity},
year = {2024},
journal = {Journal of Ceramics},
volume = {45},
number = {4},
pages = {805-811},
keywords = {uniformity, polishing process parameters, grinding, Preston equation, simulation analysis},
url = {https://www.sciopen.com/article/10.13957/j.cnki.tcxb.2024.04.019},
doi = {10.13957/j.cnki.tcxb.2024.04.019},
abstract = {This paper was aimed to address the serious issues of over-polishing and under-polishing in the production of ceramic tiles, which significantly affect product quality. Mathematical models were established to correlate polishing process parameters and motion parameters with variables related to over-polishing and under-polishing, based on the Preston equation and the grinding head outer profile trajectory equation. According to the simulation analysis results, it is revealed that over-polishing primarily occurs in the overlapping regions of the polishing trajectory, with a smaller proportion distributed in the upper and lower arc regions of the trajectory. As the polishing process parameters are modified, an increase in the width of the leak-free polishing zone corresponds to an enlargement of the overlapping area. It is possible to reduce the width of the leak-free polishing zone by 17.91%, simultaneously resulting in a 53.06% reduction in the overlapping area, by adjusting the polishing process parameters. This significant improvement effectively enhances the over-polishing situation, markedly promoting grinding uniformity. These findings offer a theoretical foundation for optimizing polishing trajectories in practical production of ceramic tiles.}
}