TY  - JOUR
AU  - HAN, Wen
AU  - YANG, Zhenheng
AU  - SUI, Xudong
AU  - XU, Lei
AU  - ZENG, Shijin
AU  - YU, Shengrui
AU  - XU, Han
PY  - 2024
TI  - Influence of Single Grinding Head Ceramic Tile Polishing Process Parameters on Grinding Uniformity
JO  - Journal of Ceramics
SN  - 2095-784X
SP  - 805
EP  - 811
VL  - 45
IS  - 4
AB  - This paper was aimed to address the serious issues of over-polishing and under-polishing in the production of ceramic tiles, which significantly affect product quality. Mathematical models were established to correlate polishing process parameters and motion parameters with variables related to over-polishing and under-polishing, based on the Preston equation and the grinding head outer profile trajectory equation. According to the simulation analysis results, it is revealed that over-polishing primarily occurs in the overlapping regions of the polishing trajectory, with a smaller proportion distributed in the upper and lower arc regions of the trajectory. As the polishing process parameters are modified, an increase in the width of the leak-free polishing zone corresponds to an enlargement of the overlapping area. It is possible to reduce the width of the leak-free polishing zone by 17.91%, simultaneously resulting in a 53.06% reduction in the overlapping area, by adjusting the polishing process parameters. This significant improvement effectively enhances the over-polishing situation, markedly promoting grinding uniformity. These findings offer a theoretical foundation for optimizing polishing trajectories in practical production of ceramic tiles.
UR  - https://doi.org/10.13957/j.cnki.tcxb.2024.04.019
DO  - 10.13957/j.cnki.tcxb.2024.04.019