AI Chat Paper
Note: Please note that the following content is generated by AMiner AI. SciOpen does not take any responsibility related to this content.
{{lang === 'zh_CN' ? '文章概述' : 'Summary'}}
{{lang === 'en_US' ? '中' : 'Eng'}}
Chat more with AI
PDF (1 MB)
Collect
Submit Manuscript AI Chat Paper
Show Outline
Outline
Show full outline
Hide outline
Outline
Show full outline
Hide outline
Article | Open Access

Mechanical Properties of Copper with Dendritic Silver Inclusions: Insights from Molecular Dynamics Simulations

Departamento de Física, Facultad de Ciencias Naturales, Matemática y del Medio Ambiente, Universidad Tecnológica Metropolitana, Las Palmeras 3360, Ñuñoa, Santiago, 7800003, Chile
Show Author Information

Abstract

This study explores the mechanical behavior of single-crystal copper with silver inclusions, focusing on the effects of dendritic and spherical geometries using molecular dynamics simulations. Uniaxial tensile tests reveal that dendritic inclusions lead to an earlier onset of plasticity due to the presence of high-strain regions at the complex inclusion/matrix interfaces, whereas spherical inclusions exhibit delayed plasticity associated with their symmetric geometry and homogeneous strain distribution. During the plastic regime, the dislocation density is primarily influenced by the volume fraction of silver inclusions rather than their shape, with spherical inclusions showing the highest densities due to their larger volume and higher silver content. Stacking faults, quantified via hexagonal closed-packed atom populations, are strongly correlated with dislocation activity but exhibit transient behavior, indicating that many faults are swept out or transformed during deformation. This transfient effect is observed in all cases, independently of the inclusion size. These findings highlight the complex interplay between inclusion geometry, dislocation activity, and stacking fault evolution in shaping the mechanical properties of copper. The study underscores the need to account for inclusion morphology and defect dynamics when designing advanced copper-based materials and suggests further investigations into the role of dendrite orientation and distribution to enhance material performance in engineering applications.

References

【1】
【1】
 
 
Computers, Materials & Continua
Pages 3665-3678

{{item.num}}

Comments on this article

Go to comment

< Back to all reports

Review Status: {{reviewData.commendedNum}} Commended , {{reviewData.revisionRequiredNum}} Revision Required , {{reviewData.notCommendedNum}} Not Commended Under Peer Review

Review Comment

Close
Close
Cite this article:
Amigo N. Mechanical Properties of Copper with Dendritic Silver Inclusions: Insights from Molecular Dynamics Simulations. Computers, Materials & Continua, 2024, 81(3): 3665-3678. https://doi.org/10.32604/cmc.2024.059895

142

Views

7

Downloads

0

Crossref

2

Web of Science

2

Scopus

Received: 19 October 2024
Accepted: 26 November 2024
Published: 31 December 2024
© The Author 2024.

This work is licensed under a Creative Commons Attribution 4.0 International License, which permits unrestricted use, distribution, and reproduction in any medium, provided the original work is properly cited.