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Research Article | Open Access

Resist Thermal Shock Through Viscoelastic Interface Encapsulation in Perovskite Solar Cells

Sai Ma1,2, Jiahong Tang1, Guizhou Yuan1, Ying Zhang1, Yan Wang1, Yuetong Wu3, Cheng Zhu1, Yimiao Wang4, Shengfang Wu4, Yue Lu2, Shumeng Chi1, Tinglu Song1, Huanping Zhou3, Manling Sui2, Yujing Li1 ( ), Qi Chen1 ( )
Beijing Key Laboratory of Construction Tailorable Advanced Functional Materials and Green Applications, MIIT Key Laboratory for Low-dimensional Quantum Structure and Devices, Experimental Center of Advanced Materials, School of Materials Science and Engineering, Beijing Institute of Technology, Beijing 100081, China
Beijing Key Laboratory of Microstructure and Properties of Solids, College of Materials Science and Engineering, Beijing University of Technology, Beijing 100124, China
School of Materials Science and Engineering, Peking University, Beijing 100871, China
Analysis and Testing Center, Jiangnan University, Wuxi 214122, China
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Abstract

Enhancing the lifetime of perovskite solar cells (PSCs) is one of the essential challenges for their industrialization. Although the external encapsulation protects the perovskite device from the erosion of moisture and oxygen under various harsh conditions. However, the perovskite devices still undergo static and dynamic thermal stress during thermal and thermal cycling aging, respectively, resulting in irreversible damage to the morphology, component, and phase of stacked materials. Herein, the viscoelastic polymer polyvinyl butyral (PVB) material is designed onto the surface of perovskite films to form flexible interface encapsulation. After PVB interface encapsulation, the surface modulus of perovskite films decreases by nearly 50%, and the interface stress range under the dynamic temperature field (−40 to 85 °C) drops from −42.5 to 64.8 MPa to −14.8 to 5.0 MPa. Besides, PVB forms chemical interactions with FA+ cations and Pb2+, and the macroscopic residual stress is regulated and defects are reduced of the PVB encapsulated perovskite film. As a result, the optimized device's efficiency increases from 22.21% to 23.11%. Additionally, after 1500 h of thermal treatment (85 °C), 1000 h of damp heat test (85 °C & 85% RH), and 250 cycles of thermal cycling test (−40 to 85 °C), the devices maintain 92.6%, 85.8%, and 96.1% of their initial efficiencies, respectively.

Keywords

device stabilityperovskite solar cellsstress fieldsurface modulusthermal shock

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Energy & Environmental Materials
Volume 7 Issue 6,
November 2024
DOI: 10.1002/eem2.12739
Cite this article:
Ma S, Tang J, Yuan G, et al. Resist Thermal Shock Through Viscoelastic Interface Encapsulation in Perovskite Solar Cells. Energy & Environmental Materials, 2024, 7(6). https://doi.org/10.1002/eem2.12739

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Received: 05 December 2023
Revised: 22 January 2024
Published: 12 February 2024
© 2024 The Authors.

This is an open access article under the terms of the Creative Commons Attribution License, which permits use, distribution and reproduction in any medium, provided the original work is properly cited.

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